XCZU17EG-2FFVE1924I
XCZU17EG-2FFVE1924I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Xilinx

XCZU17EG-2FFVE1924I


XCZU17EG-2FFVE1924I
F20-XCZU17EG-2FFVE1924I
Active
IC SOC CORTEX-A53 1924FCBGA
1924-FCBGA (45x45)

XCZU17EG-2FFVE1924I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCZU17EG-2FFVE1924I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1924
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1924
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1924,44X44,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Samacsys Manufacturer XILINX

XCZU17EG-2FFVE1924I Datasheet Download


XCZU17EG-2FFVE1924I Overview



The XCZU17EG-2FFVE1924I chip model is a powerful, high-performance digital signal processing (DSP) device suitable for a variety of embedded processing and image processing applications. It is designed to be programmed with the HDL (Hardware Description Language) language and offers significant advantages over other models on the market.


The XCZU17EG-2FFVE1924I chip model is well-suited for applications such as artificial intelligence (AI) and machine learning (ML), as well as for digital signal processing and image processing. It is also capable of handling complex tasks in the fields of robotics, autonomous vehicles and medical imaging. The chip model is expected to be increasingly in demand in the coming years as these fields, and the related industries, become more reliant on advanced digital technologies.


The XCZU17EG-2FFVE1924I chip model is also expected to be used in networks, such as 5G, and in the development of intelligent systems. It is capable of performing complex computations and is well-suited for tasks such as facial recognition, object detection and autonomous navigation. It is also expected to play an important role in the development of fully intelligent systems, such as smart homes and autonomous vehicles.


Overall, the XCZU17EG-2FFVE1924I chip model is a powerful and highly versatile device that is suitable for a variety of applications. It offers significant advantages over other models on the market and is expected to be increasingly in demand in the coming years as more industries become reliant on advanced digital technologies. The chip model is well-suited for applications in networks and intelligent systems, and is expected to play an important role in the development of fully intelligent systems in the future.



554 In Stock


I want to buy

Unit Price: $7,106.94
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $7,106.9400 $7,106.9400
10+ $6,964.8012 $69,648.0120
100+ $6,822.6624 $682,266.2400
500+ $6,751.5930 $3,375,796.5000
1000+ $6,609.4542 $6,609,454.2000
The price is for reference only, please refer to the actual quotation!

Quick Quote