

XCZU17EG-2FFVE1924I
XCZU17EG-2FFVE1924I ECAD Model
XCZU17EG-2FFVE1924I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1924 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1924 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1924,44X44,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | XILINX |
XCZU17EG-2FFVE1924I Datasheet Download
XCZU17EG-2FFVE1924I Overview
The XCZU17EG-2FFVE1924I chip model is a powerful, high-performance digital signal processing (DSP) device suitable for a variety of embedded processing and image processing applications. It is designed to be programmed with the HDL (Hardware Description Language) language and offers significant advantages over other models on the market.
The XCZU17EG-2FFVE1924I chip model is well-suited for applications such as artificial intelligence (AI) and machine learning (ML), as well as for digital signal processing and image processing. It is also capable of handling complex tasks in the fields of robotics, autonomous vehicles and medical imaging. The chip model is expected to be increasingly in demand in the coming years as these fields, and the related industries, become more reliant on advanced digital technologies.
The XCZU17EG-2FFVE1924I chip model is also expected to be used in networks, such as 5G, and in the development of intelligent systems. It is capable of performing complex computations and is well-suited for tasks such as facial recognition, object detection and autonomous navigation. It is also expected to play an important role in the development of fully intelligent systems, such as smart homes and autonomous vehicles.
Overall, the XCZU17EG-2FFVE1924I chip model is a powerful and highly versatile device that is suitable for a variety of applications. It offers significant advantages over other models on the market and is expected to be increasingly in demand in the coming years as more industries become reliant on advanced digital technologies. The chip model is well-suited for applications in networks and intelligent systems, and is expected to play an important role in the development of fully intelligent systems in the future.
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554 In Stock
Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $7,106.9400 | $7,106.9400 |
10+ | $6,964.8012 | $69,648.0120 |
100+ | $6,822.6624 | $682,266.2400 |
500+ | $6,751.5930 | $3,375,796.5000 |
1000+ | $6,609.4542 | $6,609,454.2000 |
The price is for reference only, please refer to the actual quotation! |