XCZU17EG-3FFVC1760E
XCZU17EG-3FFVC1760E ECAD Model
XCZU17EG-3FFVC1760E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 900 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 927 mV | |
| Supply Voltage-Min | 873 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1760,42X42,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | XILINX |
XCZU17EG-3FFVC1760E Datasheet Download
XCZU17EG-3FFVC1760E Overview
The XCZU17EG-3FFVC1760E chip model is an advanced FPGA (Field Programmable Gate Array) that was designed by Xilinx to provide users with a powerful and flexible platform for the development of complex hardware designs. It is a high-performance, low-power device that can be used in a variety of applications, including advanced communication systems, networks, and intelligent robots.
The original design intention of the XCZU17EG-3FFVC1760E was to provide users with a powerful and flexible platform for the development of complex hardware designs. It is equipped with a wide range of features, including high-speed transceivers, high-speed memory interfaces, and advanced logic fabric. It can also be used for a variety of applications, including high-speed networking, video processing, and machine learning.
The XCZU17EG-3FFVC1760E is also capable of being upgraded for future applications. It is equipped with a wide range of features that can be used to customize the device for specific requirements. For example, it can be used for high-speed networking, video processing, and machine learning. It is also capable of being used in the era of fully intelligent systems, as it allows for the development and popularization of intelligent robots.
In order to use the XCZU17EG-3FFVC1760E effectively, it is important to understand the technical talents that are needed to use the model. This includes having knowledge of hardware programming, digital logic design, and computer architecture. It is also important to have experience in working with FPGA devices, as well as an understanding of the various features and capabilities of the XCZU17EG-3FFVC1760E.
In conclusion, the XCZU17EG-3FFVC1760E chip model is a powerful and flexible platform for the development of complex hardware designs. It is capable of being upgraded for future applications and can be used in a variety of scenarios, including advanced communication systems, networks, and intelligent robots. In order to use the XCZU17EG-3FFVC1760E effectively, it is important to have knowledge of hardware programming, digital logic design, and computer architecture.
You May Also Be Interested In
3,567 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,661.6600 | $8,661.6600 |
| 10+ | $8,488.4268 | $84,884.2680 |
| 100+ | $8,315.1936 | $831,519.3600 |
| 500+ | $8,228.5770 | $4,114,288.5000 |
| 1000+ | $8,055.3438 | $8,055,343.8000 |
| The price is for reference only, please refer to the actual quotation! | ||