XCZU17EG-3FFVE1924E
XCZU17EG-3FFVE1924E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Xilinx

XCZU17EG-3FFVE1924E


XCZU17EG-3FFVE1924E
F20-XCZU17EG-3FFVE1924E
Active
CMOS, BGA, BGA1924,44X44,40
BGA, BGA1924,44X44,40

XCZU17EG-3FFVE1924E ECAD Model


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XCZU17EG-3FFVE1924E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1924
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1924
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1924,44X44,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU17EG-3FFVE1924E Datasheet Download


XCZU17EG-3FFVE1924E Overview



The XCZU17EG-3FFVE1924E chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with the HDL (Hardware Description Language) for programming and design. The chip model is capable of delivering superior performance, making it a great choice for advanced communication systems.


The XCZU17EG-3FFVE1924E chip model is designed with the intention of providing a high-performance solution that is capable of meeting the needs of a wide range of applications. It is designed to be highly reliable and able to handle a wide range of data rates. The chip model also features a large number of features, including a wide range of addressable memory, high-speed I/O, and advanced power management. Additionally, the chip model is designed to be easily upgradable, allowing for future expansion and development.


When designing and programming with the XCZU17EG-3FFVE1924E chip model, there are a few important considerations to keep in mind. First, the chip model is designed to be used with the HDL language, so it is important to make sure that the code is written correctly and that it is optimized for the chip model. Additionally, it is important to ensure that the design is optimized for the chip model, as this will help to ensure that the design is as efficient as possible. Additionally, it is important to consider the power management of the chip model, as this will help to ensure that the design is as efficient as possible.


Case studies have shown that the XCZU17EG-3FFVE1924E chip model is a great choice for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be highly reliable and able to handle a wide range of data rates. Additionally, the chip model is designed to be easily upgradable, allowing for future expansion and development. Furthermore, the design is optimized for the chip model, making it an efficient and reliable solution. Finally, it is important to consider the power management of the chip model, as this will help to ensure that the design is as efficient as possible.



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Unit Price: $6,929.328
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $6,444.2750 $6,444.2750
10+ $6,374.9818 $63,749.8176
100+ $6,028.5154 $602,851.5360
1000+ $5,682.0490 $2,841,024.4800
10000+ $5,196.9960 $5,196,996.0000
The price is for reference only, please refer to the actual quotation!

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