XCZU17EG-3FFVE1924E
XCZU17EG-3FFVE1924E ECAD Model
XCZU17EG-3FFVE1924E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 900 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 927 mV | |
| Supply Voltage-Min | 873 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1924 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1924 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1924,44X44,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU17EG-3FFVE1924E Datasheet Download
XCZU17EG-3FFVE1924E Overview
The XCZU17EG-3FFVE1924E chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with the HDL (Hardware Description Language) for programming and design. The chip model is capable of delivering superior performance, making it a great choice for advanced communication systems.
The XCZU17EG-3FFVE1924E chip model is designed with the intention of providing a high-performance solution that is capable of meeting the needs of a wide range of applications. It is designed to be highly reliable and able to handle a wide range of data rates. The chip model also features a large number of features, including a wide range of addressable memory, high-speed I/O, and advanced power management. Additionally, the chip model is designed to be easily upgradable, allowing for future expansion and development.
When designing and programming with the XCZU17EG-3FFVE1924E chip model, there are a few important considerations to keep in mind. First, the chip model is designed to be used with the HDL language, so it is important to make sure that the code is written correctly and that it is optimized for the chip model. Additionally, it is important to ensure that the design is optimized for the chip model, as this will help to ensure that the design is as efficient as possible. Additionally, it is important to consider the power management of the chip model, as this will help to ensure that the design is as efficient as possible.
Case studies have shown that the XCZU17EG-3FFVE1924E chip model is a great choice for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be highly reliable and able to handle a wide range of data rates. Additionally, the chip model is designed to be easily upgradable, allowing for future expansion and development. Furthermore, the design is optimized for the chip model, making it an efficient and reliable solution. Finally, it is important to consider the power management of the chip model, as this will help to ensure that the design is as efficient as possible.
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1,900 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,661.6600 | $8,661.6600 |
| 10+ | $8,488.4268 | $84,884.2680 |
| 100+ | $8,315.1936 | $831,519.3600 |
| 500+ | $8,228.5770 | $4,114,288.5000 |
| 1000+ | $8,055.3438 | $8,055,343.8000 |
| The price is for reference only, please refer to the actual quotation! | ||