|Part Life Cycle Code||Active|
|Supply Voltage-Nom||850 mV|
|uPs/uCs/Peripheral ICs Type||MICROPROCESSOR CIRCUIT|
|Supply Voltage-Max||876 mV|
|Supply Voltage-Min||825 mV|
|Moisture Sensitivity Level||4|
|Operating Temperature-Max||100 °C|
|Peak Reflow Temperature (Cel)||245|
|Time@Peak Reflow Temperature-Max (s)||30|
|Number of Terminals||1924|
|Package Body Material||PLASTIC/EPOXY|
|Package Style||GRID ARRAY|
|Terminal Finish||Tin/Silver/Copper (Sn/Ag/Cu)|
|Terminal Pitch||1 mm|
|Seated Height-Max||3.71 mm|
|Ihs Manufacturer||XILINX INC|
|Package Description||BGA, BGA1924,44X44,40|
|Reach Compliance Code||compliant|
|Date Of Intro||2017-02-15|
XCZU19EG-2FFVE1924E Datasheet Download
The chip model XCZU19EG-2FFVE1924E is a powerful and versatile integrated circuit designed to meet the needs of a wide range of applications. It is a high-performance, low-power device that can be used in a variety of applications, from consumer electronics to industrial applications. It is designed to provide a reliable, low-power solution for a variety of applications.
The XCZU19EG-2FFVE1924E is a flexible, high-performance device that is capable of supporting advanced communication systems. It is designed to provide a cost-effective solution for a wide range of applications. The device is capable of supporting a variety of communication protocols, including Wi-Fi, Bluetooth, and ZigBee. It also supports advanced signal processing, such as error correction, modulation, and coding.
The XCZU19EG-2FFVE1924E is designed to be easily upgradable to meet the needs of future applications. It is capable of supporting a variety of advanced communication protocols and features, such as advanced signal processing and error correction. The device is also designed to be compatible with a variety of operating systems and hardware platforms.
Regarding the industry trends of the chip model XCZU19EG-2FFVE1924E and the future development of related industries, it is important to consider the specific technologies that are needed for the application environment. For example, if the application requires advanced signal processing, then the XCZU19EG-2FFVE1924E is an ideal choice. Additionally, if the application requires support for a variety of communication protocols, then the device is also an excellent choice.
When considering the product description and specific design requirements of the XCZU19EG-2FFVE1924E, it is important to consider the actual case studies and precautions. For example, it is important to consider the power consumption of the device, as well as the temperature range in which the device can operate. Additionally, it is important to consider the size and weight of the device, as well as any additional features or components that may be necessary for the application.
In conclusion, the chip model XCZU19EG-2FFVE1924E is a powerful and versatile integrated circuit that is designed to meet the needs of a wide range of applications. It is capable of supporting advanced communication protocols, as well as advanced signal processing and error correction. Additionally, it is designed to be easily upgradable and compatible with a variety of operating systems and hardware platforms. It is important to consider the specific technologies that are needed for the application environment, as well as the product description and specific design requirements, in order to ensure that the XCZU19EG-2FFVE1924E is the right choice for the application.
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