XCZU19EG-2FFVE1924I
XCZU19EG-2FFVE1924I ECAD Model
XCZU19EG-2FFVE1924I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1924 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1924 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1924,44X44,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU19EG-2FFVE1924I Datasheet Download
XCZU19EG-2FFVE1924I Overview
The XCZU19EG-2FFVE1924I chip model is an advanced integrated circuit designed by Xilinx, Inc. It is an FPGA (Field Programmable Gate Array) device that combines the flexibility of a programmable logic device with the power of an ASIC (Application Specific Integrated Circuit). It is designed for use in high-performance, high-speed applications such as communication systems, networks, and intelligent systems.
The XCZU19EG-2FFVE1924I chip model offers a wide range of features, including high-speed transceivers, high-performance memory, and a wide range of I/O capabilities. It is designed to support the latest technologies, such as PCIe, Ethernet, and USB 3.0. It also supports advanced communication protocols such as 10Gbps Ethernet, 5Gbps USB, and 100Gbps Infiniband.
The XCZU19EG-2FFVE1924I chip model is designed to be highly scalable, which means it can be upgraded to meet the growing demands of the future. It is designed to be compatible with the latest technologies, including the 5G network, artificial intelligence, and machine learning. It is also designed to be used in advanced communication systems such as 5G networks, high-speed data centers, and autonomous vehicles.
The XCZU19EG-2FFVE1924I chip model can be used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. It can be used to control robotic systems, provide real-time feedback, and process data from multiple sources. It is also designed to be used in fully intelligent systems, such as autonomous vehicles, smart homes, and smart cities.
In conclusion, the XCZU19EG-2FFVE1924I chip model is an advanced integrated circuit designed by Xilinx, Inc. It is designed to be highly scalable and compatible with the latest technologies, such as 5G networks, artificial intelligence, and machine learning. It is also designed to be used in advanced communication systems, networks, and intelligent scenarios. As the industry trends continue to evolve, the XCZU19EG-2FFVE1924I chip model is likely to remain at the forefront of technology and continue to be a reliable and powerful tool for the future.
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2,769 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7,827.7200 | $7,827.7200 |
| 10+ | $7,671.1656 | $76,711.6560 |
| 100+ | $7,514.6112 | $751,461.1200 |
| 500+ | $7,436.3340 | $3,718,167.0000 |
| 1000+ | $7,279.7796 | $7,279,779.6000 |
| The price is for reference only, please refer to the actual quotation! | ||