XCZU19EG-2FFVE1924I
XCZU19EG-2FFVE1924I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Xilinx

XCZU19EG-2FFVE1924I


XCZU19EG-2FFVE1924I
F20-XCZU19EG-2FFVE1924I
Active
CMOS, BGA, BGA1924,44X44,40
BGA, BGA1924,44X44,40

XCZU19EG-2FFVE1924I ECAD Model


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XCZU19EG-2FFVE1924I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1924
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1924
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1924,44X44,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU19EG-2FFVE1924I Datasheet Download


XCZU19EG-2FFVE1924I Overview



The XCZU19EG-2FFVE1924I chip model is an advanced integrated circuit designed by Xilinx, Inc. It is an FPGA (Field Programmable Gate Array) device that combines the flexibility of a programmable logic device with the power of an ASIC (Application Specific Integrated Circuit). It is designed for use in high-performance, high-speed applications such as communication systems, networks, and intelligent systems.


The XCZU19EG-2FFVE1924I chip model offers a wide range of features, including high-speed transceivers, high-performance memory, and a wide range of I/O capabilities. It is designed to support the latest technologies, such as PCIe, Ethernet, and USB 3.0. It also supports advanced communication protocols such as 10Gbps Ethernet, 5Gbps USB, and 100Gbps Infiniband.


The XCZU19EG-2FFVE1924I chip model is designed to be highly scalable, which means it can be upgraded to meet the growing demands of the future. It is designed to be compatible with the latest technologies, including the 5G network, artificial intelligence, and machine learning. It is also designed to be used in advanced communication systems such as 5G networks, high-speed data centers, and autonomous vehicles.


The XCZU19EG-2FFVE1924I chip model can be used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. It can be used to control robotic systems, provide real-time feedback, and process data from multiple sources. It is also designed to be used in fully intelligent systems, such as autonomous vehicles, smart homes, and smart cities.


In conclusion, the XCZU19EG-2FFVE1924I chip model is an advanced integrated circuit designed by Xilinx, Inc. It is designed to be highly scalable and compatible with the latest technologies, such as 5G networks, artificial intelligence, and machine learning. It is also designed to be used in advanced communication systems, networks, and intelligent scenarios. As the industry trends continue to evolve, the XCZU19EG-2FFVE1924I chip model is likely to remain at the forefront of technology and continue to be a reliable and powerful tool for the future.



4,177 In Stock


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Unit Price: $6,262.176
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,823.8237 $5,823.8237
10+ $5,761.2019 $57,612.0192
100+ $5,448.0931 $544,809.3120
1000+ $5,134.9843 $2,567,492.1600
10000+ $4,696.6320 $4,696,632.0000
The price is for reference only, please refer to the actual quotation!

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