XCZU2EG-3SFVC784E
XCZU2EG-3SFVC784E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
AMD Xilinx

XCZU2EG-3SFVC784E


XCZU2EG-3SFVC784E
F20-XCZU2EG-3SFVC784E
Active
CMOS, BGA
BGA

XCZU2EG-3SFVC784E ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCZU2EG-3SFVC784E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Temperature Grade OTHER
JESD-30 Code S-PBGA-B784
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 784
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
HTS Code 8542.31.00.01

XCZU2EG-3SFVC784E Datasheet Download


XCZU2EG-3SFVC784E Overview



The chip model XCZU2EG-3SFVC784E is a high-performance chip designed for digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with HDL language, which is a hardware description language used to define and describe the behavior of hardware. This chip is designed to provide high performance computing capabilities and is suitable for a wide range of applications.


The chip model XCZU2EG-3SFVC784E is designed to meet the needs of the industry and keep up with the latest trends. It is designed to be able to take advantage of the latest technologies and advancements in the field. It is also designed to be able to upgrade and evolve with the industry, allowing it to be used in more advanced communication systems.


The original design intention of the chip model XCZU2EG-3SFVC784E was to provide a powerful and reliable chip for digital signal processing, embedded processing, image processing, and other applications. It is designed to be able to take advantage of the latest technologies and advancements in the field. It is also designed to be able to upgrade and evolve with the industry, allowing it to be used in more advanced communication systems.


The chip model XCZU2EG-3SFVC784E is designed to provide high performance computing capabilities and is suitable for a wide range of applications. It is designed to meet the needs of the industry and keep up with the latest trends. It is also designed to be able to upgrade and evolve with the industry, allowing it to be used in more advanced communication systems.


In conclusion, the chip model XCZU2EG-3SFVC784E is a powerful and reliable chip designed for digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with HDL language, which is a hardware description language used to define and describe the behavior of hardware. It is designed to meet the needs of the industry and keep up with the latest trends. It is also designed to be able to upgrade and evolve with the industry, allowing it to be used in more advanced communication systems.



3,492 In Stock


I want to buy

Unit Price: $435.76
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $405.2568 $405.2568
10+ $400.8992 $4,008.9920
100+ $379.1112 $37,911.1200
1000+ $357.3232 $178,661.6000
10000+ $326.8200 $326,820.0000
The price is for reference only, please refer to the actual quotation!

Quick Quote