|Part Life Cycle Code||Active|
|Supply Voltage-Nom||900 mV|
|uPs/uCs/Peripheral ICs Type||PROGRAMMABLE SoC|
|Supply Voltage-Max||927 mV|
|Supply Voltage-Min||873 mV|
|Moisture Sensitivity Level||4|
|Operating Temperature-Max||100 °C|
|Peak Reflow Temperature (Cel)||250|
|Time@Peak Reflow Temperature-Max (s)||30|
|Number of Terminals||784|
|Package Body Material||PLASTIC/EPOXY|
|Package Equivalence Code||BGA784,28X28,32|
|Package Style||GRID ARRAY|
|Terminal Finish||TIN SILVER COPPER|
|Terminal Pitch||800 µm|
|Seated Height-Max||3.32 mm|
|Ihs Manufacturer||XILINX INC|
|Reach Compliance Code||compliant|
XCZU5EG-3SFVC784E Datasheet Download
The chip model XCZU5EG-3SFVC784E is a powerful and efficient chip that is designed to meet the needs of a wide range of applications. It has been designed with the latest technologies and features to ensure that it is suitable for use in the most demanding scenarios.
In terms of industry trends, the XCZU5EG-3SFVC784E chip is at the forefront of the industry with its advanced features and capabilities. It is capable of handling the most complex tasks, making it suitable for use in a variety of applications. This chip is also capable of supporting new technologies, making it suitable for use in the most advanced networks and applications.
In terms of future applications, the XCZU5EG-3SFVC784E chip is capable of supporting a wide range of intelligent scenarios. It is suitable for use in the era of fully intelligent systems, as it is capable of handling complex tasks and providing real-time analysis and feedback. This chip is also capable of providing support for new technologies, allowing it to be used in the most advanced networks and applications.
In terms of product description and design requirements, the XCZU5EG-3SFVC784E chip is specifically designed to meet the needs of a wide range of applications. It is capable of providing the highest levels of performance, reliability, and scalability. It is also capable of providing the most advanced features and capabilities, making it suitable for use in the most demanding scenarios.
Finally, actual case studies and precautions should be taken when using the XCZU5EG-3SFVC784E chip. By understanding the specific design requirements and features of the chip, it is possible to ensure that it is suitable for use in the most demanding scenarios. Additionally, by understanding the potential pitfalls of using the chip, it is possible to ensure that it is used in the most efficient and effective manner.
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