XCZU7CG-L1FFVF1517I
XCZU7CG-L1FFVF1517I ECAD Model
XCZU7CG-L1FFVF1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | XILINX |
XCZU7CG-L1FFVF1517I Datasheet Download
XCZU7CG-L1FFVF1517I Overview
The XCZU7CG-L1FFVF1517I chip model is an advanced integrated circuit that offers a variety of advantages to its users. It is designed to provide a powerful and reliable platform for a range of applications, from embedded systems to communication systems. The chip model is based on the Xilinx UltraScale+ architecture, which is an advanced and highly efficient technology.
The XCZU7CG-L1FFVF1517I chip model is designed to provide a high degree of flexibility and scalability. It provides a wide range of features, including memory, storage, and network interfaces. It also provides support for a range of communication protocols, such as Ethernet, Wi-Fi, and Bluetooth. The chip model is also capable of supporting a variety of operating systems, including Linux, Android, and Windows.
The XCZU7CG-L1FFVF1517I chip model is expected to experience increasing demand in the future, as it is designed to meet the needs of a variety of industries. It is expected to be used in a range of applications, including embedded systems, communication systems, and network systems. It is also likely to be used in the development of advanced communication systems, such as 5G and 6G.
The XCZU7CG-L1FFVF1517I chip model is designed to be upgradable and is expected to be used in the development of advanced communication systems. It is also likely to be used in the development of intelligent systems, such as autonomous vehicles, smart homes, and smart cities. It is also likely to be used in the development of networks for the Internet of Things (IoT) and in the development of fully intelligent systems.
In conclusion, the XCZU7CG-L1FFVF1517I chip model is an advanced integrated circuit that provides a powerful and reliable platform for a range of applications. It is expected to experience increasing demand in the future, as it is designed to meet the needs of a variety of industries. It is also designed to be upgradable and is expected to be used in the development of advanced communication systems, networks for the Internet of Things (IoT), and fully intelligent systems.
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1,135 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,195.5400 | $3,195.5400 |
| 10+ | $3,131.6292 | $31,316.2920 |
| 100+ | $3,067.7184 | $306,771.8400 |
| 500+ | $3,035.7630 | $1,517,881.5000 |
| 1000+ | $2,971.8522 | $2,971,852.2000 |
| The price is for reference only, please refer to the actual quotation! | ||