XCZU7EG-1FFVF1517I
XCZU7EG-1FFVF1517I ECAD Model
XCZU7EG-1FFVF1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | XILINX |
XCZU7EG-1FFVF1517I Datasheet Download
XCZU7EG-1FFVF1517I Overview
The chip model XCZU7EG-1FFVF1517I is a new type of chip model that has been released in recent years. It is a high-performance and low-power FPGA chip model, which is suitable for a wide range of applications, such as embedded systems, industrial automation, and communication systems. The chip model is based on the Xilinx UltraScale+ architecture, which provides high-performance, low-power, and low-cost solutions. It is equipped with a variety of features, such as a high-performance processor, high-speed transceivers, and a variety of memory interfaces.
The XCZU7EG-1FFVF1517I chip model has been widely used in the industry, and its use has been increasing in recent years. The chip model is expected to be used in more applications in the future, such as embedded systems, industrial automation, and communication systems. With its high-performance, low-power, and low-cost features, the chip model is expected to be widely used in the development of future intelligent robots.
The chip model XCZU7EG-1FFVF1517I is also expected to be used in the development of new technologies in the future. It is expected to be used in the development of new technologies such as artificial intelligence, machine learning, and deep learning. The chip model is expected to be used in the development of new technologies that are needed to support the application environment of future intelligent robots.
In order to use the chip model XCZU7EG-1FFVF1517I effectively, certain technical talents are required. Technical talents such as computer engineers, software engineers, and hardware engineers are needed to develop and implement the chip model in an application environment. These technical talents should be familiar with the Xilinx UltraScale+ architecture and be able to develop applications for the chip model.
In conclusion, the chip model XCZU7EG-1FFVF1517I is a high-performance, low-power, and low-cost FPGA chip model that is suitable for a wide range of applications. The chip model is expected to be used in the development of future intelligent robots and the development of new technologies in the future. In order to use the chip model effectively, certain technical talents are required.
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3,168 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,059.0100 | $3,059.0100 |
| 10+ | $2,997.8298 | $29,978.2980 |
| 100+ | $2,936.6496 | $293,664.9600 |
| 500+ | $2,906.0595 | $1,453,029.7500 |
| 1000+ | $2,844.8793 | $2,844,879.3000 |
| The price is for reference only, please refer to the actual quotation! | ||