XCZU7EG-1FFVF1517I
XCZU7EG-1FFVF1517I
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rohs
AMD Xilinx

XCZU7EG-1FFVF1517I


XCZU7EG-1FFVF1517I
F20-XCZU7EG-1FFVF1517I
Active
CMOS, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

XCZU7EG-1FFVF1517I ECAD Model


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XCZU7EG-1FFVF1517I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7EG-1FFVF1517I Datasheet Download


XCZU7EG-1FFVF1517I Overview



The chip model XCZU7EG-1FFVF1517I is a new type of chip model that has been released in recent years. It is a high-performance and low-power FPGA chip model, which is suitable for a wide range of applications, such as embedded systems, industrial automation, and communication systems. The chip model is based on the Xilinx UltraScale+ architecture, which provides high-performance, low-power, and low-cost solutions. It is equipped with a variety of features, such as a high-performance processor, high-speed transceivers, and a variety of memory interfaces.


The XCZU7EG-1FFVF1517I chip model has been widely used in the industry, and its use has been increasing in recent years. The chip model is expected to be used in more applications in the future, such as embedded systems, industrial automation, and communication systems. With its high-performance, low-power, and low-cost features, the chip model is expected to be widely used in the development of future intelligent robots.


The chip model XCZU7EG-1FFVF1517I is also expected to be used in the development of new technologies in the future. It is expected to be used in the development of new technologies such as artificial intelligence, machine learning, and deep learning. The chip model is expected to be used in the development of new technologies that are needed to support the application environment of future intelligent robots.


In order to use the chip model XCZU7EG-1FFVF1517I effectively, certain technical talents are required. Technical talents such as computer engineers, software engineers, and hardware engineers are needed to develop and implement the chip model in an application environment. These technical talents should be familiar with the Xilinx UltraScale+ architecture and be able to develop applications for the chip model.


In conclusion, the chip model XCZU7EG-1FFVF1517I is a high-performance, low-power, and low-cost FPGA chip model that is suitable for a wide range of applications. The chip model is expected to be used in the development of future intelligent robots and the development of new technologies in the future. In order to use the chip model effectively, certain technical talents are required.



2,176 In Stock


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Unit Price: $2,447.208
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,275.9034 $2,275.9034
10+ $2,251.4314 $22,514.3136
100+ $2,129.0710 $212,907.0960
1000+ $2,006.7106 $1,003,355.2800
10000+ $1,835.4060 $1,835,406.0000
The price is for reference only, please refer to the actual quotation!

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