

XCZU7EG-2FFVF1517E
XCZU7EG-2FFVF1517E ECAD Model
XCZU7EG-2FFVF1517E Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1517 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.51 mm | |
Width | 40 mm | |
Length | 40 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | XILINX | |
Date Of Intro | 2017-02-15 |
XCZU7EG-2FFVF1517E Datasheet Download
XCZU7EG-2FFVF1517E Overview
The chip model XCZU7EG-2FFVF1517E is a high-end, high-performance chip model developed by Xilinx, Inc. It is designed to provide high-end, high-speed computing capabilities to support a variety of applications. With the rapid development of the Internet of Things and artificial intelligence, the demand for high-performance chips is increasing. The XCZU7EG-2FFVF1517E is an ideal choice for users who need high-end computing capabilities.
The XCZU7EG-2FFVF1517E chip model has a number of advantages, including a high-performance FPGA, a high-speed processor, and a large memory. It is designed to provide high-speed computing capabilities and support a variety of applications. The chip model is also designed to be highly reliable and stable, and it is capable of providing long-term performance. In addition, the chip model is designed to be power-efficient, making it an ideal choice for users who need to reduce their power consumption.
The XCZU7EG-2FFVF1517E chip model is expected to have increasing demand in the future. With the development of the Internet of Things and artificial intelligence, the demand for high-performance chips is increasing. The XCZU7EG-2FFVF1517E is an ideal choice for users who need high-end computing capabilities. In addition, the chip model is designed to be highly reliable and stable, and it is capable of providing long-term performance.
The product description and specific design requirements of the XCZU7EG-2FFVF1517E chip model are as follows: the chip model has a high-performance FPGA, a high-speed processor, and a large memory. It is designed to provide high-speed computing capabilities and support a variety of applications. The chip model is also designed to be highly reliable and stable, and it is capable of providing long-term performance. In addition, the chip model is designed to be power-efficient, making it an ideal choice for users who need to reduce their power consumption.
When using the XCZU7EG-2FFVF1517E chip model, it is important to ensure that the application environment has the necessary support for new technologies. Depending on the specific technologies required, the chip model may need to be configured differently. It is also important to consider the actual case studies and precautions when using the chip model.
In conclusion, the XCZU7EG-2FFVF1517E chip model is a high-end, high-performance chip model developed by Xilinx, Inc. It is designed to provide high-end, high-speed computing capabilities to support a variety of applications. It is expected to have increasing demand in the future due to the development of the Internet of Things and artificial intelligence. In addition, the chip model is designed to be highly reliable and stable, and it is capable of providing long-term performance. When using the chip model, it is important to ensure that the application environment has the necessary support for new technologies, and to consider the actual case studies and precautions.
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1,815 In Stock
Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,425.5500 | $3,425.5500 |
10+ | $3,357.0390 | $33,570.3900 |
100+ | $3,288.5280 | $328,852.8000 |
500+ | $3,254.2725 | $1,627,136.2500 |
1000+ | $3,185.7615 | $3,185,761.5000 |
The price is for reference only, please refer to the actual quotation! |