XCZU7EG-3FBVB900E
XCZU7EG-3FBVB900E
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rohs
Xilinx

XCZU7EG-3FBVB900E


XCZU7EG-3FBVB900E
F20-XCZU7EG-3FBVB900E
Active
IC SOC CORTEX-A53 900FCBGA
900-FCBGA (31x31)

XCZU7EG-3FBVB900E ECAD Model


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XCZU7EG-3FBVB900E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7EG-3FBVB900E Datasheet Download


XCZU7EG-3FBVB900E Overview



The XCZU7EG-3FBVB900E chip model is a powerful and versatile model that has been designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a high-level language for hardware description and design. This chip model is highly advantageous due to its low power consumption, high performance, and small size.


The XCZU7EG-3FBVB900E chip model is expected to be in high demand in the future due to its versatility and performance. It is expected to be used in a variety of industries, including automotive, medical, industrial, and consumer electronics. The chip model is also expected to be used in robotics, artificial intelligence, and machine learning applications.


The future demand for the XCZU7EG-3FBVB900E chip model is expected to be driven by the need for new technologies to support its application environment. The chip model is expected to be used in applications that require advanced processing capabilities, such as image processing, video processing, and audio processing. Additionally, the chip model is expected to be used in applications that require high-speed data transfer and storage.


The XCZU7EG-3FBVB900E chip model is expected to be in high demand in the future due to its versatility and performance. It is expected to be used in a variety of industries, including automotive, medical, industrial, and consumer electronics. This chip model is also expected to be used in robotics, artificial intelligence, and machine learning applications due to its advanced processing capabilities. Furthermore, the chip model is expected to be used in applications that require high-speed data transfer and storage.


Overall, the XCZU7EG-3FBVB900E chip model is highly advantageous due to its low power consumption, high performance, and small size. It is expected to be in high demand in the future due to its versatility and performance, and its ability to meet the needs of a variety of industries. The chip model is also expected to be used in applications that require advanced processing capabilities, as well as high-speed data transfer and storage. As the need for new technologies to support the application environment increases, so too will the demand for the XCZU7EG-3FBVB900E chip model.



1,588 In Stock


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Unit Price: $4,113.12
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,113.1200 $4,113.1200
10+ $4,030.8576 $40,308.5760
100+ $3,948.5952 $394,859.5200
500+ $3,907.4640 $1,953,732.0000
1000+ $3,825.2016 $3,825,201.6000
The price is for reference only, please refer to the actual quotation!

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