|Part Life Cycle Code||Active|
|Supply Voltage-Nom||900 mV|
|uPs/uCs/Peripheral ICs Type||MICROPROCESSOR CIRCUIT|
|Supply Voltage-Max||927 mV|
|Supply Voltage-Min||873 mV|
|Moisture Sensitivity Level||4|
|Operating Temperature-Max||100 °C|
|Peak Reflow Temperature (Cel)||245|
|Time@Peak Reflow Temperature-Max (s)||30|
|Number of Terminals||1156|
|Package Body Material||PLASTIC/EPOXY|
|Package Style||GRID ARRAY|
|Terminal Finish||Tin/Silver/Copper (Sn/Ag/Cu)|
|Ihs Manufacturer||XILINX INC|
|Package Description||BGA, BGA1156,34X34,40|
|Reach Compliance Code||compliant|
XCZU7EG-3FFVC1156E Datasheet Download
The XCZU7EG-3FFVC1156E chip model is a powerful and versatile integrated circuit that offers a wide range of capabilities for network and intelligent system applications. This model is designed to meet the demands of modern industry, and has the potential to become a cornerstone of the next generation of intelligent systems.
The XCZU7EG-3FFVC1156E chip model is a high-performance, low-power system-on-chip that combines a dual-core ARM Cortex-A9 processor with a Xilinx Ultrascale+ FPGA. The chip model is designed to provide an optimized solution for a wide range of applications, including networking, embedded systems, and machine learning. It features a wide range of features, including a high-speed DDR4 memory interface, advanced power management, and a highly configurable FPGA fabric.
The XCZU7EG-3FFVC1156E chip model offers a variety of advantages for network and intelligent system applications. It is capable of supporting a wide range of network protocols, including Ethernet, Wi-Fi, and Zigbee. It also supports a variety of machine learning algorithms, allowing for the development of intelligent systems. In addition, the chip model offers a high degree of flexibility, allowing for the development of custom designs and applications.
In terms of future demand trends for the XCZU7EG-3FFVC1156E chip model, the demand for integrated circuits with advanced features and capabilities is expected to increase significantly in the coming years. This increased demand is driven by the need for more powerful and efficient network and intelligent system solutions. As such, the XCZU7EG-3FFVC1156E chip model is well-positioned to meet the demands of the future.
The XCZU7EG-3FFVC1156E chip model is capable of being used in a variety of intelligent scenarios, including autonomous vehicles, robotics, and smart home applications. It is also capable of being used in the era of fully intelligent systems, as it offers a wide range of features and capabilities that are necessary for the development of such systems.
In terms of product description and design requirements, the XCZU7EG-3FFVC1156E chip model is designed to meet the needs of modern industry. It features a wide range of features, including a high-speed DDR4 memory interface, advanced power management, and a highly configurable FPGA fabric. It also offers a wide range of capabilities, including support for a variety of network protocols, machine learning algorithms, and custom designs.
In terms of actual case studies, the XCZU7EG-3FFVC1156E chip model has been used in a variety of applications, including autonomous vehicles, robotics, and smart home applications. It has also been used in the development of fully intelligent systems, and has proven to be a reliable and powerful solution for such applications.
When it comes to precautions, it is important to ensure that the XCZU7EG-3FFVC1156E chip model is properly configured for the specific application. It is also important to ensure that the chip model is properly tested and verified before being deployed in a live environment. Additionally, it is important to ensure that the chip model is properly maintained and updated to ensure its continued reliability and performance.
You May Also Be Interested In
2,481 In Stock
|QTY||Unit Price||Ext Price|
|The price is for reference only, please refer to the actual quotation!|