|Part Life Cycle Code||Active|
|Supply Voltage-Nom||720 mV|
|uPs/uCs/Peripheral ICs Type||MICROPROCESSOR CIRCUIT|
|Additional Feature||ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY|
|Supply Voltage-Max||742 mV|
|Supply Voltage-Min||698 mV|
|Moisture Sensitivity Level||4|
|Operating Temperature-Max||100 °C|
|Operating Temperature-Min||-40 °C|
|Peak Reflow Temperature (Cel)||245|
|Time@Peak Reflow Temperature-Max (s)||30|
|Number of Terminals||900|
|Package Body Material||PLASTIC/EPOXY|
|Package Style||GRID ARRAY|
|Terminal Finish||Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)|
|Ihs Manufacturer||XILINX INC|
|Reach Compliance Code||compliant|
XCZU7EG-L1FBVB900I Datasheet Download
XCZU7EG-L1FBVB900I is a new chip model developed by Xilinx, Inc. It is an advanced 28nm ultra-low power FPGA designed for high-end applications. The XCZU7EG-L1FBVB900I integrates a wide range of features and technologies to provide designers with a powerful platform for developing their applications.
One of the main advantages of the XCZU7EG-L1FBVB900I is its low power consumption. It has an extremely low static power consumption of less than 0.5W, which is significantly lower than other FPGAs on the market. This makes it ideal for applications that require low power consumption, such as battery-powered devices. Additionally, the XCZU7EG-L1FBVB900I is highly configurable, allowing designers to tailor their applications to their specific needs.
The XCZU7EG-L1FBVB900I is also designed to be future-proof. It is capable of supporting the latest technologies, such as PCIe Gen3, USB 3.0, and DDR4. This means that the XCZU7EG-L1FBVB900I can be used in advanced communication systems, such as 5G networks. Additionally, Xilinx offers a range of software tools and development boards that make it easy to develop applications for the XCZU7EG-L1FBVB900I.
The XCZU7EG-L1FBVB900I has a wide range of features that make it suitable for a variety of applications. It has a large number of configurable I/Os, as well as a high-speed transceiver. Additionally, the XCZU7EG-L1FBVB900I also supports a range of advanced technologies, such as PCIe Gen3, USB 3.0, and DDR4. This makes it suitable for a variety of applications, such as industrial automation, medical imaging, and communication systems.
The XCZU7EG-L1FBVB900I is a powerful and versatile FPGA that can be used in a variety of applications. Its low power consumption, configurability, and support for advanced technologies make it an ideal choice for designers looking for a powerful platform for their applications. Additionally, Xilinx offers a range of software tools and development boards that make it easy to develop applications for the XCZU7EG-L1FBVB900I.
Given the advantages of the XCZU7EG-L1FBVB900I, it is expected that demand for this chip model will continue to increase in the future. As the demand for advanced communication systems increases, the XCZU7EG-L1FBVB900I will become increasingly popular as a platform for developing these systems. Additionally, as more applications are developed for this chip model, demand for it is expected to increase.
When designing applications for the XCZU7EG-L1FBVB900I, it is important to consider the product description and specific design requirements. The product description outlines the features and capabilities of the chip model, as well as the design requirements for developing applications for it. Additionally, it is important to consider actual case studies and precautions when designing applications for the XCZU7EG-L1FBVB900I. This will help ensure that the application is designed correctly and is able to meet the requirements of the application.
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