XCZU7EV-3FBVB900E
XCZU7EV-3FBVB900E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
AMD Xilinx

XCZU7EV-3FBVB900E


XCZU7EV-3FBVB900E
F20-XCZU7EV-3FBVB900E
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU7EV-3FBVB900E ECAD Model


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XCZU7EV-3FBVB900E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7EV-3FBVB900E Datasheet Download


XCZU7EV-3FBVB900E Overview



The XCZU7EV-3FBVB900E chip model is a highly efficient and powerful chip designed for high-performance digital signal processing, embedded processing, and image processing. It is developed with the latest technologies and is compatible with the HDL language. This chip is designed to meet the needs of various industries, providing a reliable and cost-effective solution for their needs.


The chip model XCZU7EV-3FBVB900E is designed to provide superior performance for a variety of industries, including automotive, aerospace, medical, and consumer electronics. It is capable of handling complex tasks, such as image processing, data analysis, and artificial intelligence. This chip model is also highly reliable, providing a stable platform for the development of new applications.


The XCZU7EV-3FBVB900E chip model is designed to be compatible with the latest technologies and standards. This ensures that the chip is able to operate in any environment, regardless of the technology being used. This also ensures that the chip is able to keep up with the latest trends in the industry.


The XCZU7EV-3FBVB900E chip model is also designed to be cost-effective. This chip model is designed to provide a reliable solution at an affordable price. This makes it an attractive option for businesses that need a reliable solution without breaking the bank.


The XCZU7EV-3FBVB900E chip model is expected to be in high demand in the future as the need for high-performance digital signal processing, embedded processing, and image processing continues to grow. This chip model is designed to provide a reliable and cost-effective solution for businesses that need a reliable solution without breaking the bank. As the demand for this chip model increases, the need for new technologies to support it will also increase. This chip model is expected to remain in high demand for many years to come.



1,868 In Stock


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Unit Price: $3,467.616
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,224.8829 $3,224.8829
10+ $3,190.2067 $31,902.0672
100+ $3,016.8259 $301,682.5920
1000+ $2,843.4451 $1,421,722.5600
10000+ $2,600.7120 $2,600,712.0000
The price is for reference only, please refer to the actual quotation!

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