XCZU9EG-3FFVC900E
XCZU9EG-3FFVC900E
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rohs
Xilinx

XCZU9EG-3FFVC900E


XCZU9EG-3FFVC900E
F20-XCZU9EG-3FFVC900E
Active
IC SOC CORTEX-A53 900FCBGA
900-FCBGA (31x31)

XCZU9EG-3FFVC900E ECAD Model


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XCZU9EG-3FFVC900E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Samacsys Manufacturer XILINX

XCZU9EG-3FFVC900E Datasheet Download


XCZU9EG-3FFVC900E Overview



The chip model XCZU9EG-3FFVC900E is a powerful and efficient processor designed for high-performance computing applications. It is manufactured by Xilinx, a leader in programmable logic solutions. This model is based on the Zynq UltraScale+ MPSoC architecture and is designed for high-speed data processing, networking, and embedded systems. The XCZU9EG-3FFVC900E offers a wide range of features and capabilities, including support for multiple communication protocols, a variety of memory options, and advanced hardware acceleration.


The XCZU9EG-3FFVC900E has already been widely adopted in the industry, and its popularity is expected to increase in the future. This is due to its ability to provide high-performance computing solutions at a lower cost than traditional solutions. It is also expected to be used in a variety of applications, such as industrial automation, automotive, medical, and consumer electronics. The chip model is also expected to be used in the development of 5G networks and the Internet of Things (IoT), providing a platform for connecting devices and systems.


The XCZU9EG-3FFVC900E is also expected to be used in the development of intelligent systems. This is due to its ability to process large amounts of data quickly and accurately. It can be used in a variety of scenarios, such as machine learning, natural language processing, image recognition, and autonomous vehicles. The chip model is also suitable for use in the era of fully intelligent systems, as it can provide the processing power and flexibility needed for such applications.


In conclusion, the XCZU9EG-3FFVC900E is a powerful and efficient processor designed for high-performance computing applications. It is expected to be widely used in the industry in the future, as it offers a wide range of features and capabilities, including support for multiple communication protocols, a variety of memory options, and advanced hardware acceleration. The chip model is also expected to be used in the development of 5G networks and the Internet of Things (IoT), as well as in the development of intelligent systems. It is suitable for use in the era of fully intelligent systems, as it can provide the processing power and flexibility needed for such applications.



3,520 In Stock


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Unit Price: $4,676.46
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,676.4600 $4,676.4600
10+ $4,582.9308 $45,829.3080
100+ $4,489.4016 $448,940.1600
500+ $4,442.6370 $2,221,318.5000
1000+ $4,349.1078 $4,349,107.8000
The price is for reference only, please refer to the actual quotation!

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