XCZU9EG-L1FFVC900I
XCZU9EG-L1FFVC900I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Xilinx

XCZU9EG-L1FFVC900I


XCZU9EG-L1FFVC900I
F20-XCZU9EG-L1FFVC900I
Active
IC SOC CORTEX-A53 900FCBGA
900-FCBGA (31x31)

XCZU9EG-L1FFVC900I ECAD Model


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XCZU9EG-L1FFVC900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FCBGA-900
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Samacsys Manufacturer XILINX

XCZU9EG-L1FFVC900I Datasheet Download


XCZU9EG-L1FFVC900I Overview



The XCZU9EG-L1FFVC900I chip model is a powerful processor designed for high-performance digital signal processing, embedded processing, and image processing. This chip model is capable of handling complex tasks and is highly reliable in performance. It is also designed to be used with HDL (hardware description language) for programming.


The XCZU9EG-L1FFVC900I chip model is designed to provide high performance, reliability, and scalability. It is equipped with a high-speed processor, a large memory, and a wide range of I/O options. It also has a flexible architecture that can be easily adapted to different application requirements. The chip model is also designed to be energy-efficient and cost-effective.


The XCZU9EG-L1FFVC900I chip model is suitable for applications such as digital signal processing, embedded processing, image processing, and more. It is expected that the demand for this chip model will continue to grow in the future as more applications require high-performance processing.


In order to use the XCZU9EG-L1FFVC900I chip model, designers must have a good understanding of the product description, design requirements, and actual case studies. Designers must also take into account the power consumption, operating temperature, and other factors when designing the chip. In addition, designers must also be aware of the potential risks associated with the chip model and take the necessary precautions to ensure safe and reliable operation.


In conclusion, the XCZU9EG-L1FFVC900I chip model is a powerful processor designed for high-performance digital signal processing, embedded processing, and image processing. It offers high performance, reliability, scalability, and cost-effectiveness. The demand for this chip model is expected to grow in the future as more applications require high-performance processing. Designers must have a good understanding of the product description, design requirements, and actual case studies in order to use the chip model safely and effectively.



3,239 In Stock


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Unit Price: $3,356.67
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,356.6700 $3,356.6700
10+ $3,289.5366 $32,895.3660
100+ $3,222.4032 $322,240.3200
500+ $3,188.8365 $1,594,418.2500
1000+ $3,121.7031 $3,121,703.1000
The price is for reference only, please refer to the actual quotation!

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