XCZU9EG-L2FFVB1156E
XCZU9EG-L2FFVB1156E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Xilinx

XCZU9EG-L2FFVB1156E


XCZU9EG-L2FFVB1156E
F20-XCZU9EG-L2FFVB1156E
Active
IC SOC CORTEX-A53 1156FCBGA
1156-FCBGA (35x35)

XCZU9EG-L2FFVB1156E ECAD Model


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XCZU9EG-L2FFVB1156E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 110 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FCBGA-1156
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Samacsys Manufacturer XILINX

XCZU9EG-L2FFVB1156E Datasheet Download


XCZU9EG-L2FFVB1156E Overview



The chip model XCZU9EG-L2FFVB1156E is a cutting-edge semiconductor device with a wide range of applications. It is designed to meet the needs of the most demanding projects, and its features make it suitable for a variety of industries, including networking, automotive, and industrial control.


The chip model XCZU9EG-L2FFVB1156E is a highly integrated device that provides a high level of performance and flexibility. It supports the latest technologies and is designed to meet the needs of the most demanding applications. It has a wide range of features including high-speed data processing, low-power consumption, and advanced security features.


The chip model XCZU9EG-L2FFVB1156E is a powerful and versatile device that can be used in a variety of scenarios. It can be used for networking applications, including wireless networks, and can be used in automotive, industrial control, and other applications. It can also be used in intelligent systems, such as those used in smart homes and other applications.


In terms of industry trends, the chip model XCZU9EG-L2FFVB1156E is designed to meet the needs of the most demanding projects. It is designed to be highly reliable and versatile, and is designed to meet the needs of the most demanding applications. It is designed to be able to handle the most demanding tasks, and is designed to be able to handle the most demanding tasks with the highest level of performance.


In terms of future applications, the chip model XCZU9EG-L2FFVB1156E is designed to be able to handle the most demanding tasks with the highest level of performance. It is designed to be able to handle the most demanding tasks with the highest level of performance, and is designed to be able to handle the most demanding tasks with the highest level of performance. It is designed to be able to handle the most demanding tasks with the highest level of performance, and is designed to be able to handle the most demanding tasks with the highest level of performance.


In terms of product description and design requirements, the chip model XCZU9EG-L2FFVB1156E is designed to meet the needs of the most demanding projects. It is designed to be highly reliable and versatile, and is designed to meet the needs of the most demanding applications. It is designed to be able to handle the most demanding tasks with the highest level of performance.


In terms of actual case studies and precautions, the chip model XCZU9EG-L2FFVB1156E is designed to be highly reliable and versatile, and is designed to meet the needs of the most demanding applications. It is designed to be able to handle the most demanding tasks with the highest level of performance. It is designed to be able to handle the most demanding tasks with the highest level of performance, and is designed to be able to handle the most demanding tasks with the highest level of performance.


Overall, the chip model XCZU9EG-L2FFVB1156E is a cutting-edge device with a wide range of applications. It is designed to meet the needs of the most demanding projects, and its features make it suitable for a variety of industries, including networking, automotive, and industrial control. It is designed to be highly reliable and versatile, and is designed to meet the needs of the most demanding applications. It is designed to be able to handle the most demanding tasks with the highest level of performance, and is designed to be able to handle the most demanding tasks with the highest level of performance. It is also designed to be able to handle the most demanding tasks with the highest level of performance in the era of fully intelligent systems.



572 In Stock


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Unit Price: $3,127.1347
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,127.1347 $3,127.1347
10+ $3,064.5920 $30,645.9201
100+ $3,002.0493 $300,204.9312
500+ $2,970.7780 $1,485,388.9825
1000+ $2,908.2353 $2,908,235.2710
The price is for reference only, please refer to the actual quotation!

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