XCVU23P-2VSVA1365I
XCVU23P-2VSVA1365I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Xilinx

XCVU23P-2VSVA1365I


XCVU23P-2VSVA1365I
F20-XCVU23P-2VSVA1365I
Active
IC FPGA VIRTEX-UP 1365FCBGA
1365-FCBGA (35x35)

XCVU23P-2VSVA1365I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCVU23P-2VSVA1365I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex® UltraScale+™
Package Tray
Number of LABs/CLBs 128700
Number of Logic Elements/Cells 2252250
Total RAM Bits 77909197
Number of I/O 364
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1365-BFBGA, FCBGA
Supplier Device Package 1365-FCBGA (35x35)

XCVU23P-2VSVA1365I Datasheet Download


XCVU23P-2VSVA1365I Overview



The XCVU23P-2VSVA1365I is an advanced field programmable gate array (FPGA) chip designed by Xilinx. It is based on the Virtex UltraScale+ platform and has a 28nm process node. This chip offers a wide range of features, including up to 23.3 million system logic cells, up to 1.3 million adaptive logic modules, up to 4.2 million flip-flops, up to 1.3 million RAM blocks, up to 2.6 million DSP slices, and up to 8.2 million total I/O. It also has up to 6.8 TeraMACs of DSP performance, up to 21.4Tb/s of transceiver bandwidth, and up to 4.2Tb/s of memory bandwidth.


The XCVU23P-2VSVA1365I is designed for a variety of applications, including artificial intelligence (AI), machine learning (ML), 5G communications, automotive, video and image processing, data center acceleration, and more. It provides a high level of performance, scalability, and reliability, making it suitable for a wide range of applications. Additionally, it has a low power consumption, making it an ideal choice for embedded applications.


In summary, the XCVU23P-2VSVA1365I is an advanced FPGA chip designed by Xilinx. It offers a wide range of features, including up to 23.3 million system logic cells, up to 1.3 million adaptive logic modules, up to 4.2 million flip-flops, up to 1.3 million RAM blocks, up to 2.6 million DSP slices, up to 8.2 million total I/O, up to 6.8 TeraMACs of DSP performance, up to 21.4Tb/s of transceiver bandwidth, and up to 4.2Tb/s of memory bandwidth. It is suitable for a variety of applications, including AI, ML, 5G communications, automotive, video and image processing, data center acceleration, and more.



666 In Stock


I want to buy

Unit Price: $58,653.78
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $58,653.7800 $58,653.7800
10+ $57,480.7044 $574,807.0440
100+ $56,307.6288 $5,630,762.8800
500+ $55,721.0910 $27,860,545.5000
1000+ $54,548.0154 $54,548,015.4000
The price is for reference only, please refer to the actual quotation!

Quick Quote