XCZU1EG-2SBVA484E
XCZU1EG-2SBVA484E
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Xilinx

XCZU1EG-2SBVA484E


XCZU1EG-2SBVA484E
F20-XCZU1EG-2SBVA484E
Active
IC ZUP MPSOC A53 FPGA 484BGA
484-FCBGA (19x19)

XCZU1EG-2SBVA484E ECAD Model


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XCZU1EG-2SBVA484E Attributes


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XCZU1EG-2SBVA484E Overview



The chip model XCZU1EG-2SBVA484E is a cutting-edge product of the semiconductor industry, developed and manufactured by Xilinx. It is a powerful and versatile chip model, suitable for a wide range of applications. As a multi-core processor, it is capable of providing high-performance computing and communication services for a variety of applications.


The chip model XCZU1EG-2SBVA484E is equipped with a high-performance processor, memory, and I/O interface. The processor core is based on the Xilinx UltraScale+ architecture, which provides up to 16 cores of high-performance computing. The memory is based on the DDR4 technology, which provides up to 64GB of memory. The I/O interface is based on the PCIe Gen4 technology, which provides up to 16 lanes of high-speed communication.


In terms of industry trends, the XCZU1EG-2SBVA484E is expected to be widely used in a variety of applications, such as artificial intelligence, Internet of Things, and 5G communication. The chip model is suitable for high-performance computing and communication services, and is expected to be widely used in the future.


The original design intention of the chip model XCZU1EG-2SBVA484E is to provide a powerful and versatile solution for a wide range of applications. The chip model is designed to be highly scalable, with the ability to upgrade to newer versions of the processor core and memory, as well as the latest version of the I/O interface. This allows the chip model to be used in advanced communication systems, such as 5G networks.


In conclusion, the chip model XCZU1EG-2SBVA484E is a powerful and versatile solution for a wide range of applications. It is expected to be widely used in the future, as it is capable of providing high-performance computing and communication services. The chip model is also highly scalable, with the ability to upgrade to newer versions of the processor core and memory, as well as the latest version of the I/O interface. This allows the chip model to be used in advanced communication systems, such as 5G networks. The chip model is designed to meet the needs of the future, and is expected to be an important part of the semiconductor industry in the coming years.



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