10AX057H4F34E3SG
10AX057H4F34E3SG ECAD Model
10AX057H4F34E3SG Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Arria 10 GX | |
Package | Tray | |
Number of LABs/CLBs | 217080 | |
Number of Logic Elements/Cells | 570000 | |
Total RAM Bits | 42082304 | |
Number of I/O | 492 | |
Voltage - Supply | 0.87V ~ 0.93V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 100°C (TJ) | |
Package / Case | 1152-BBGA, FCBGA | |
Supplier Device Package | 1152-FCBGA (35x35) |
10AX057H4F34E3SG Datasheet Download
10AX057H4F34E3SG Overview
The 10AX057H4F34E3SG is a high-performance, low-power, low-cost integrated circuit (IC) from the 10AX family of chips manufactured by Altera. It is a field programmable gate array (FPGA) device with a total of 57,600 logic elements and 4,096 Kbits of embedded memory. It is designed to deliver a high level of performance and reliability in a variety of applications.
The 10AX057H4F34E3SG has a total of four transceivers that offer a data rate of up to 12.5 Gbps. It also has a total of 34 I/O banks, each with up to 28 I/O pins. The chip also features up to 32 dedicated differential pairs per bank, as well as a total of 11 dedicated quad-mode transceivers.
The 10AX057H4F34E3SG is ideal for applications such as wireless communications, video processing, data storage, and networking. It is also suitable for applications that require high-speed data transfer, such as high-speed serial links, high-speed Ethernet, and high-speed video.
The 10AX057H4F34E3SG is available in a range of packages, including a ball grid array (BGA), a fine-pitch ball grid array (FBGA), and a thin quad flat package (TQFP). It is also available with an optional thermal management package that helps to improve heat dissipation.
In summary, the 10AX057H4F34E3SG is a high-performance, low-power, low-cost FPGA device that is suitable for a wide range of applications. It features four transceivers, 34 I/O banks, up to 32 differential pairs per bank, and 11 quad-mode transceivers. It is available in a range of packages and with an optional thermal management package.
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