5SGXEA3K1F35C2LN
5SGXEA3K1F35C2LN
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Intel

5SGXEA3K1F35C2LN


5SGXEA3K1F35C2LN
F18-5SGXEA3K1F35C2LN
Active
IC FPGA 432 I/O 1152FBGA
1152-FBGA (35x35)

5SGXEA3K1F35C2LN ECAD Model


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5SGXEA3K1F35C2LN Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 128300
Number of Logic Elements/Cells 340000
Total RAM Bits 19456000
Number of I/O 432
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5SGXEA3

5SGXEA3K1F35C2LN Datasheet Download


5SGXEA3K1F35C2LN Overview



The 5SGXEA3K1F35C2LN chip model is a high-performance, low-power FPGA from Altera Corporation. It is designed to provide a wide range of features and capabilities for a variety of applications, from consumer to industrial, from medical to automotive. This model is ideal for designers who need to reduce the power consumption of their design while still maintaining the highest levels of performance.


The 5SGXEA3K1F35C2LN chip model offers several advantages over other FPGA models. It is designed with a low-power architecture, allowing it to consume less power while still providing high performance. Additionally, it has a wide range of features and capabilities, including an embedded processor and memory, high-speed I/O, and advanced communication systems. This makes it suitable for a variety of applications, from consumer to industrial, from medical to automotive.


The 5SGXEA3K1F35C2LN chip model is expected to experience increased demand in the future due to its low power consumption and high performance. Additionally, as technology continues to advance, the 5SGXEA3K1F35C2LN chip model can be upgraded to meet the demands of more advanced communication systems. This would make the chip model even more attractive to designers and engineers who need to keep up with the latest technology.


The 5SGXEA3K1F35C2LN chip model has a wide range of features and capabilities, making it suitable for a variety of applications. It is designed with an embedded processor and memory, high-speed I/O, and advanced communication systems. Additionally, it is designed with a low-power architecture, allowing it to consume less power while still providing high performance.


When designing with the 5SGXEA3K1F35C2LN chip model, it is important to consider the specific design requirements of the application. This includes the type of application, the performance requirements, and the power budget. Additionally, it is important to consider any potential upgrades that may need to be made to the chip model in order to keep up with advancing technology.


Case studies can provide valuable insight into the design and implementation of the 5SGXEA3K1F35C2LN chip model. Additionally, when designing with the chip model, it is important to consider any potential pitfalls or risks associated with the design. This includes potential power issues, timing issues, and compatibility issues.


In conclusion, the 5SGXEA3K1F35C2LN chip model is a high-performance, low-power FPGA from Altera Corporation. It is designed to provide a wide range of features and capabilities for a variety of applications, from consumer to industrial, from medical to automotive. This model is expected to experience increased demand in the future due to its low power consumption and high performance. Additionally, it can be upgraded to meet the demands of more advanced communication systems. When designing with the chip model, it is important to consider the specific design requirements of the application and any potential pitfalls or risks associated with the design. Case studies can provide valuable insight into the design and implementation of the 5SGXEA3K1F35C2LN chip model.



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