EP20K1000EFC672-3
EP20K1000EFC672-3
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rohs
Intel

EP20K1000EFC672-3


EP20K1000EFC672-3
F18-EP20K1000EFC672-3
Active
IC FPGA 508 I/O 672FBGA
672-FBGA (27x27)

EP20K1000EFC672-3 ECAD Model


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EP20K1000EFC672-3 Attributes


Type Description Select
Mfr Intel
Series APEX-20KE®
Package Tray
Number of LABs/CLBs 3840
Number of Logic Elements/Cells 38400
Total RAM Bits 327680
Number of I/O 508
Number of Gates 1772000
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 672-BBGA
Supplier Device Package 672-FBGA (27x27)
Base Product Number EP20K1000

EP20K1000EFC672-3 Datasheet Download


EP20K1000EFC672-3 Overview



Chip model EP20K1000EFC672-3 is an integrated circuit (IC) that is designed to meet the needs of various industries. It is a versatile and reliable solution for many applications, and is suitable for a wide range of applications such as networking, industrial, automotive, and consumer electronics. The chip model EP20K1000EFC672-3 features a wide range of features such as high speed, low power consumption, and high reliability.


The chip model EP20K1000EFC672-3 was designed with the intention of providing a reliable and efficient solution for various industries. It is capable of providing high speed, low power consumption, and high reliability. It has been designed to meet the requirements of a wide range of applications, including networking, industrial, automotive, and consumer electronics. The chip model EP20K1000EFC672-3 is also designed to be easily upgradeable, allowing for future upgrades to be made to the chip model.


The chip model EP20K1000EFC672-3 is designed with specific requirements in mind. It is designed to be able to handle a wide range of communication systems, including advanced communication systems. It is also designed to be able to handle a wide range of data speeds, from low speeds to high speeds. The chip model EP20K1000EFC672-3 is also designed to be able to handle a wide range of temperatures, from cold temperatures to hot temperatures.


In terms of expected demand trends for the chip model EP20K1000EFC672-3 in related industries in the future, it is expected that the chip model will continue to be in demand in the future. This is due to the fact that the chip model is designed to meet the needs of various industries, and is capable of providing a reliable and efficient solution for various applications. Furthermore, the chip model is designed to be easily upgradeable, allowing for future upgrades to be made to the chip model.


In terms of actual case studies and precautions, it is important to note that the chip model EP20K1000EFC672-3 is designed to be used in a variety of applications. It is important to ensure that the chip model is used in accordance with the intended application. Furthermore, it is important to ensure that the chip model is used in accordance with the manufacturer's instructions and specifications. Additionally, it is important to ensure that the chip model is used in a safe and secure environment.


In conclusion, the chip model EP20K1000EFC672-3 is an integrated circuit (IC) that is designed to meet the needs of various industries. It is a versatile and reliable solution for many applications, and is suitable for a wide range of applications such as networking, industrial, automotive, and consumer electronics. The chip model is designed to be able to handle a wide range of communication systems, including advanced communication systems. It is also designed to be able to handle a wide range of data speeds, from low speeds to high speeds. Furthermore, it is designed to be able to handle a wide range of temperatures, from cold temperatures to hot temperatures. It is also designed to be easily upgradeable, allowing for future upgrades to be made to the chip model. In terms of expected demand trends for the chip model EP20K1000EFC672-3 in related industries in the future, it is expected that the chip model will continue to be in demand in the future. It is important to ensure that the chip model is used in accordance with the intended application, the manufacturer's instructions and specifications, and in a safe and secure environment.



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