EP3SL50F780C2
EP3SL50F780C2
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rohs
Intel

EP3SL50F780C2


EP3SL50F780C2
F18-EP3SL50F780C2
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-780
FBGA-780

EP3SL50F780C2 ECAD Model


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EP3SL50F780C2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 488
Number of Outputs 488
Number of Logic Cells 47500
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Additional Feature IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Clock Frequency-Max 800 MHz
Power Supplies 1.2/3.3 V
Supply Voltage-Max 940 mV
Supply Voltage-Min 860 mV
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP3SL50F780C2 Datasheet Download


EP3SL50F780C2 Overview



The chip model EP3SL50F780C2 is a high-performance digital signal processor (DSP) that is suitable for a variety of applications, such as embedded processing, image processing, and more. This chip model is designed to be compatible with the HDL language, which is a high-level language used to program digital logic. It is a powerful tool for designing and implementing complex digital systems.


The EP3SL50F780C2 chip model has several advantages that make it a great choice for many applications. It has a high-performance processor, a large memory capacity, and a wide range of I/O ports. It also supports multiple operating systems and is designed for low power consumption. Additionally, it has a high level of integration, which means that it can be used in a wide variety of applications with minimal hardware requirements.


The EP3SL50F780C2 chip model is expected to be increasingly in demand in the future, as more and more applications require the use of digital signal processing. This chip model is particularly useful in applications that require high-speed processing, such as image processing and embedded systems. Additionally, the chip model is highly compatible with HDL, which makes it easier to design and implement complex digital systems.


When designing a system with the EP3SL50F780C2 chip model, it is important to consider the specific design requirements. The chip model has a wide range of I/O ports, and the specific ports used must be determined based on the application. Additionally, the amount of memory required must be taken into account, as well as the operating system and power consumption requirements.


To ensure that the EP3SL50F780C2 chip model is used correctly, it is important to consider actual case studies and pay attention to any potential issues. For example, if the system is designed to run at high speeds, it is important to consider the power consumption of the chip model and make sure that it is not being overworked. Additionally, it is important to consider the specific design requirements of the application and make sure that the chip model is compatible with the HDL language.


In conclusion, the EP3SL50F780C2 chip model is a high-performance digital signal processor that is suitable for a variety of applications. It has a wide range of I/O ports, a large memory capacity, and is designed to be compatible with the HDL language. It is expected to be increasingly in demand in the future, as more and more applications require the use of digital signal processing. When designing a system with the EP3SL50F780C2 chip model, it is important to consider the specific design requirements and pay attention to any potential issues.



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1+ $937.7541 $937.7541
10+ $918.9990 $9,189.9902
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1000+ $872.1113 $872,111.3130
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