EP3SL70F780C3
EP3SL70F780C3 ECAD Model
EP3SL70F780C3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 488 | |
| Number of Outputs | 488 | |
| Number of Logic Cells | 67500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
| Clock Frequency-Max | 717 MHz | |
| Power Supplies | 1.2/3.3 V | |
| Supply Voltage-Max | 940 mV | |
| Supply Voltage-Min | 860 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP3SL70F780C3 Datasheet Download
EP3SL70F780C3 Overview
The chip model EP3SL70F780C3 is a high-performance, low power, and cost-effective FPGA device. It is designed to meet the requirements of high-performance digital signal processing, embedded processing, image processing, and other applications. The device is suitable for use with the HDL language and can be used to develop advanced communication systems.
The EP3SL70F780C3 is designed to provide a high level of performance while consuming minimal power. It features a low-power, high-speed logic core and a configurable I/O interface. The device also features a high-speed memory system and a wide array of configurable logic blocks. These features make the device ideal for a variety of applications, including high-speed digital signal processing, embedded processing, and image processing.
The EP3SL70F780C3 also offers a number of features that make it suitable for use in advanced communication systems. The device supports multiple protocols, including Ethernet, USB, and Serial ATA. It can also be used to develop custom communication solutions. The device also offers a wide variety of configurable logic blocks, allowing for the development of complex systems.
The EP3SL70F780C3 also offers a number of features that make it suitable for use in advanced communication systems. The device supports multiple protocols, including Ethernet, USB, and Serial ATA. It can also be used to develop custom communication solutions. The device also offers a wide variety of configurable logic blocks, allowing for the development of complex systems.
The EP3SL70F780C3 also offers a number of features that make it suitable for use in advanced communication systems. The device supports multiple protocols, including Ethernet, USB, and Serial ATA. It can also be used to develop custom communication solutions. The device also offers a wide variety of configurable logic blocks, allowing for the development of complex systems.
In terms of upgradability, the EP3SL70F780C3 is designed to be easily upgradable. The device is designed to be compatible with a wide range of software and hardware tools, making it possible to upgrade the device with minimal effort. The device is also designed to be easily reprogrammable, allowing for the development of new applications and features.
When designing with the EP3SL70F780C3, it is important to consider the specific design requirements of the device. The device requires the use of HDL language, and the design should be optimized for speed, power, and cost. It is also important to consider the device's memory system and configurable logic blocks, as they can affect the performance of the device.
Finally, when using the EP3SL70F780C3, it is important to consider the potential risks associated with the device. It is important to ensure that the design is properly tested and verified before deployment, as the device can be vulnerable to errors and security risks. Additionally, it is important to consider the potential impact of any changes to the device, as they can affect the performance and reliability of the system.
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4,001 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,136.2559 | $1,136.2559 |
| 10+ | $1,113.5308 | $11,135.3078 |
| 100+ | $1,090.8057 | $109,080.5664 |
| 500+ | $1,079.4431 | $539,721.5525 |
| 1000+ | $1,056.7180 | $1,056,717.9870 |
| The price is for reference only, please refer to the actual quotation! | ||