EPF10K200EBC600-2
EPF10K200EBC600-2 ECAD Model
EPF10K200EBC600-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 600 ps | |
| Number of Inputs | 470 | |
| Number of Outputs | 470 | |
| Number of Logic Cells | 9984 | |
| Number of I/O Lines | 470 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 470 I/O | |
| Output Function | MIXED | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PBGA-B600 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 600 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA600,35X35,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 1.93 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA600,35X35,50 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF10K200EBC600-2 Datasheet Download
EPF10K200EBC600-2 Overview
The chip model EPF10K200EBC600-2 is a state-of-the-art semiconductor device developed by Altera Corporation. It is a high-performance, low-power FPGA that combines a powerful embedded processor and a number of programmable logic blocks. This chip model has been widely used in different industries, such as industrial automation, medical equipment, aerospace, automotive, and consumer electronics.
The EPF10K200EBC600-2 chip model is designed with a number of features that make it attractive to the industrial users. It has a low power consumption and a high-performance architecture which makes it suitable for a wide range of applications. The chip model also features a large number of programmable logic blocks and embedded processors that can be used to customize the design of the device. It also has a large number of I/O pins, which makes it possible to connect to a wide range of external devices.
The EPF10K200EBC600-2 chip model has been widely used in industrial automation, medical equipment, aerospace, automotive, and consumer electronics. In the future, the demand for this chip model is expected to increase due to its high performance and low power consumption. The chip model is also expected to be used in more advanced communication systems, as it can provide a high-speed connection between different devices.
The EPF10K200EBC600-2 chip model can also be used in the development and popularization of future intelligent robots. This chip model is designed with a number of features that make it suitable for the development of robotic systems. It can be used to control the movement of the robot, as well as to provide a connection to external devices. To use the chip model effectively, it is necessary to have technical skills such as programming, electronic engineering, and robotics.
The EPF10K200EBC600-2 chip model is a powerful and reliable device that has been widely used in different industries. It has a low power consumption and a high-performance architecture which makes it suitable for a wide range of applications. In the future, the demand for this chip model is expected to increase due to its high performance and low power consumption. It can also be used in the development and popularization of future intelligent robots. To use the chip model effectively, it is necessary to have technical skills such as programming, electronic engineering, and robotics.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||