EPF10K50SFC256-1
EPF10K50SFC256-1 ECAD Model
EPF10K50SFC256-1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 300 ps | |
| Number of Inputs | 191 | |
| Number of Outputs | 191 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 191 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 191 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K50SFC256-1 Datasheet Download
EPF10K50SFC256-1 Overview
The chip model EPF10K50SFC256-1 is an integrated circuit designed for advanced communication systems. It is designed to provide high-speed digital signal processing and communication functions for a variety of applications. This model is manufactured by a leading semiconductor manufacturer and is widely used in various industries.
The original design intention of the chip model EPF10K50SFC256-1 is to provide a low-cost, high-performance solution for advanced communication systems. It is designed to provide a wide range of features, including high-speed data transmission, low-power consumption, and scalability. It is also designed to be compatible with a variety of communication protocols, such as Ethernet, Wi-Fi, Bluetooth, and others.
The product description of the chip model EPF10K50SFC256-1 includes the following features: a 256-bit data bus, a 10K gate count, a 50MHz clock speed, and a 2.5V power supply. It is also designed to be compatible with a variety of communication protocols and is suitable for use in a variety of applications. Additionally, it is designed to be highly scalable and can be upgraded to meet the needs of future applications.
In terms of actual case studies, the chip model EPF10K50SFC256-1 has been used in a variety of applications, including wireless communication, digital signal processing, and machine vision. It has also been used in a variety of industrial applications, such as factory automation and robotics. In addition, it has been used in the development of advanced intelligent robots.
When using the chip model EPF10K50SFC256-1, there are a few important precautions to keep in mind. First, it is important to ensure that the chip is properly installed and connected to the system. Additionally, it is important to ensure that the power supply is properly configured and that the system is properly grounded. Finally, it is important to ensure that the system is properly shielded from electromagnetic interference.
Overall, the chip model EPF10K50SFC256-1 is a powerful and versatile solution for advanced communication systems. It is designed to provide high-speed data transmission, low-power consumption, and scalability. It is also suitable for use in a variety of applications, including wireless communication, digital signal processing, and machine vision. Furthermore, it is suitable for use in the development and popularization of future intelligent robots, although the use of this model may require the assistance of technical professionals.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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