EPF10K50SFC256-2X
EPF10K50SFC256-2X
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs
Intel

EPF10K50SFC256-2X


EPF10K50SFC256-2X
F18-EPF10K50SFC256-2X
Active
LOADABLE PLD, 400 ps, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

EPF10K50SFC256-2X ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

EPF10K50SFC256-2X Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 400 ps
Number of Inputs 191
Number of Outputs 191
Number of Logic Cells 2880
Number of I/O Lines 191
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 191 I/O
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA256,16X16,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EPF10K50SFC256-2X Datasheet Download


EPF10K50SFC256-2X Overview



The chip model EPF10K50SFC256-2X is a powerful tool for the development of intelligent networks and systems. It is designed to provide a high degree of flexibility, allowing developers to easily design and implement complex applications, while also providing a wide range of features to support the development of intelligent systems.


The EPF10K50SFC256-2X is a powerful chip model that can be used in a variety of applications. It is capable of providing a high degree of flexibility, allowing developers to easily design and implement complex applications, while also providing a wide range of features to support the development of intelligent systems. The chip model provides a wide range of features, such as a wide range of memory and storage capacity, a wide range of communication protocols, and a wide range of advanced algorithms. It is also capable of providing a high degree of scalability, allowing developers to easily scale their applications to larger networks and systems.


The EPF10K50SFC256-2X is a powerful chip model that can be used in a variety of intelligent scenarios. It is capable of providing a high degree of flexibility, allowing developers to easily design and implement complex applications, while also providing a wide range of features to support the development of intelligent systems. The chip model is capable of providing a wide range of features, such as a wide range of memory and storage capacity, a wide range of communication protocols, and a wide range of advanced algorithms. It is also capable of providing a high degree of scalability, allowing developers to easily scale their applications to larger networks and systems.


The EPF10K50SFC256-2X is a powerful chip model that can be used in a variety of intelligent scenarios. It can be used in the development and popularization of future intelligent robots, as well as in the development of fully intelligent systems. In order to use the model effectively, developers must have a strong understanding of the model's features and capabilities, as well as a strong knowledge of the various algorithms and communication protocols that the model supports. Additionally, developers must have a strong understanding of the various hardware and software components that are necessary for the development of intelligent systems.


In order to use the EPF10K50SFC256-2X effectively, developers must have a strong understanding of the chip model's features and capabilities, as well as a strong knowledge of the various algorithms and communication protocols that the model supports. Additionally, developers must have a strong understanding of the various hardware and software components that are necessary for the development of intelligent systems. It is also important to understand the actual case studies and precautions that must be taken when using the model, as well as the potential risks associated with using the model.


The EPF10K50SFC256-2X is a powerful chip model that can be used in a variety of intelligent scenarios. It is capable of providing a high degree of flexibility, allowing developers to easily design and implement complex applications, while also providing a wide range of features to support the development of intelligent systems. The chip model is capable of providing a wide range of features, such as a wide range of memory and storage capacity, a wide range of communication protocols, and a wide range of advanced algorithms. It is also capable of providing a high degree of scalability, allowing developers to easily scale their applications to larger networks and systems. With the right technical talents, the EPF10K50SFC256-2X can be a powerful tool for the development of intelligent networks and systems in the era of fully intelligent systems.



1,189 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote