EPF10K50SFC256-2X
EPF10K50SFC256-2X ECAD Model
EPF10K50SFC256-2X Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 400 ps | |
Number of Inputs | 191 | |
Number of Outputs | 191 | |
Number of Logic Cells | 2880 | |
Number of I/O Lines | 191 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 191 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA256,16X16,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EPF10K50SFC256-2X Datasheet Download
EPF10K50SFC256-2X Overview
The chip model EPF10K50SFC256-2X is a powerful tool for the development of intelligent networks and systems. It is designed to provide a high degree of flexibility, allowing developers to easily design and implement complex applications, while also providing a wide range of features to support the development of intelligent systems.
The EPF10K50SFC256-2X is a powerful chip model that can be used in a variety of applications. It is capable of providing a high degree of flexibility, allowing developers to easily design and implement complex applications, while also providing a wide range of features to support the development of intelligent systems. The chip model provides a wide range of features, such as a wide range of memory and storage capacity, a wide range of communication protocols, and a wide range of advanced algorithms. It is also capable of providing a high degree of scalability, allowing developers to easily scale their applications to larger networks and systems.
The EPF10K50SFC256-2X is a powerful chip model that can be used in a variety of intelligent scenarios. It is capable of providing a high degree of flexibility, allowing developers to easily design and implement complex applications, while also providing a wide range of features to support the development of intelligent systems. The chip model is capable of providing a wide range of features, such as a wide range of memory and storage capacity, a wide range of communication protocols, and a wide range of advanced algorithms. It is also capable of providing a high degree of scalability, allowing developers to easily scale their applications to larger networks and systems.
The EPF10K50SFC256-2X is a powerful chip model that can be used in a variety of intelligent scenarios. It can be used in the development and popularization of future intelligent robots, as well as in the development of fully intelligent systems. In order to use the model effectively, developers must have a strong understanding of the model's features and capabilities, as well as a strong knowledge of the various algorithms and communication protocols that the model supports. Additionally, developers must have a strong understanding of the various hardware and software components that are necessary for the development of intelligent systems.
In order to use the EPF10K50SFC256-2X effectively, developers must have a strong understanding of the chip model's features and capabilities, as well as a strong knowledge of the various algorithms and communication protocols that the model supports. Additionally, developers must have a strong understanding of the various hardware and software components that are necessary for the development of intelligent systems. It is also important to understand the actual case studies and precautions that must be taken when using the model, as well as the potential risks associated with using the model.
The EPF10K50SFC256-2X is a powerful chip model that can be used in a variety of intelligent scenarios. It is capable of providing a high degree of flexibility, allowing developers to easily design and implement complex applications, while also providing a wide range of features to support the development of intelligent systems. The chip model is capable of providing a wide range of features, such as a wide range of memory and storage capacity, a wide range of communication protocols, and a wide range of advanced algorithms. It is also capable of providing a high degree of scalability, allowing developers to easily scale their applications to larger networks and systems. With the right technical talents, the EPF10K50SFC256-2X can be a powerful tool for the development of intelligent networks and systems in the era of fully intelligent systems.
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1,189 In Stock
Pricing (USD)
QTY | Unit Price | Ext Price |
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