EPF10K50SFC484-2XB
EPF10K50SFC484-2XB
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rohs
Intel

EPF10K50SFC484-2XB


EPF10K50SFC484-2XB
F18-EPF10K50SFC484-2XB
Active
LOADABLE PLD, 400 ps, BGA, BGA484,22X22,40
BGA, BGA484,22X22,40

EPF10K50SFC484-2XB ECAD Model


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EPF10K50SFC484-2XB Attributes


Type Description Select
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 400 ps
Number of Inputs 254
Number of Outputs 254
Number of I/O Lines 254
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Organization 254 I/O
Output Function MIXED
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B484
Operating Temperature-Max 70 °C
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA484,22X22,40
Reach Compliance Code unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EPF10K50SFC484-2XB Datasheet Download


EPF10K50SFC484-2XB Overview



The chip model EPF10K50SFC484-2XB is a high-performance digital signal processor (DSP) that is suitable for applications requiring high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the hardware description language (HDL) and offers a wide range of features and functions that are suitable for many different applications.


The EPF10K50SFC484-2XB is an ideal choice for applications that require high-speed, reliable processing of digital signals, such as in networks and intelligent systems. It is capable of handling large amounts of data quickly and accurately, making it a great choice for applications that require quick response times and accurate results.


The EPF10K50SFC484-2XB has a number of features and design requirements that make it suitable for a variety of applications. It is designed to be compatible with the latest HDL standards and offers a range of features such as a high-speed clock, low-power consumption, and high-resolution image processing. Additionally, it is designed to be compatible with various operating systems, allowing it to be used in a wide range of scenarios.


When designing applications that involve the EPF10K50SFC484-2XB, it is important to ensure that the design requirements are met and that the chip is correctly configured for the specific application. This includes taking into account the design requirements of the chip, such as the clock speed, power consumption, and image processing capabilities. Additionally, it is important to consider the potential applications of the chip, such as in networks and intelligent systems, and ensure that the design requirements are met.


In order to ensure the successful implementation of the EPF10K50SFC484-2XB, there are a number of precautions that must be taken. This includes ensuring that the chip is correctly configured for the specific application, as well as ensuring that the design requirements are met. Additionally, it is important to ensure that the chip is correctly tested and verified before being put into use, as this will help to ensure that the chip is working correctly and that the application is running as expected.


Overall, the EPF10K50SFC484-2XB is a high-performance digital signal processor that is suitable for applications requiring high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the hardware description language (HDL) and offers a wide range of features and functions that are suitable for many different applications, including networks and intelligent systems. In order to ensure the successful implementation of the EPF10K50SFC484-2XB, it is important to ensure that the design requirements are met and that the chip is correctly configured for the specific application. Additionally, it is important to ensure that the chip is correctly tested and verified before being put into use.



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