EPF6024AFC256-3
EPF6024AFC256-3 ECAD Model
EPF6024AFC256-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 219 | |
| Number of Outputs | 219 | |
| Number of Logic Cells | 1960 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 219 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 219 I/O | |
| Clock Frequency-Max | 133 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
EPF6024AFC256-3 Datasheet Download
EPF6024AFC256-3 Overview
The chip model EPF6024AFC256-3 is a highly integrated, low-power, and cost-effective solution for a variety of applications. It is designed to provide a robust and reliable performance in a wide range of environments. This chip model is widely used in consumer electronics, automotive, and industrial applications. It is also suitable for a variety of communication systems, such as wireless networks, cellular networks, and the Internet of Things (IoT).
The EPF6024AFC256-3 chip model is based on advanced technologies such as Field Programmable Gate Arrays (FPGAs), microcontrollers, and analog-to-digital converters (ADCs). It is designed to provide high-speed, low-power, and cost-effective performance. It also provides a wide range of features such as advanced memory protection, on-chip debugging, and fault detection.
The EPF6024AFC256-3 chip model has the potential to be upgraded in the future. It can be used in advanced communication systems and networks, such as 5G and 6G networks. It can also be used in intelligent scenarios such as autonomous driving and smart home systems. In addition, it can be used in the era of fully intelligent systems, such as smart cities and the Internet of Things (IoT).
The EPF6024AFC256-3 chip model is a powerful and reliable solution for a variety of applications. It has the potential to be used in advanced communication systems and networks, as well as intelligent scenarios. It is also suitable for the era of fully intelligent systems. Therefore, it is important to keep an eye on the industry trends of the chip model EPF6024AFC256-3 and the future development of related industries. It is also important to consider which specific technologies may be needed in the application environment.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||