EPF8282ALC84-3
EPF8282ALC84-3 ECAD Model
EPF8282ALC84-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 68 | |
| Number of Outputs | 64 | |
| Number of Logic Cells | 208 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 68 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 68 I/O | |
| Additional Feature | 208 LOGIC ELEMENTS | |
| Clock Frequency-Max | 385 MHz | |
| Output Function | REGISTERED | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | QCCJ, LDCC84,1.2SQ | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF8282ALC84-3 Datasheet Download
EPF8282ALC84-3 Overview
The chip model EPF8282ALC84-3 is a powerful device that has been designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a Field Programmable Gate Array (FPGA) device that uses the HDL language for programming. This makes it an ideal choice for engineers looking for a reliable and efficient solution for their projects.
The chip model EPF8282ALC84-3 offers a variety of advantages, such as low power consumption, high speed, and the ability to be reprogrammed without the need for external hardware. It also has a wide range of applications, from communications and networking to medical and industrial applications. As such, the chip model EPF8282ALC84-3 is expected to be in high demand in the near future.
In terms of industry trends, the chip model EPF8282ALC84-3 is expected to be used in a variety of industries due to its versatility and efficiency. As technology continues to evolve, the chip model EPF8282ALC84-3 will likely be used in more advanced applications, such as artificial intelligence, machine learning, and autonomous systems. As these technologies become more commonplace, the chip model EPF8282ALC84-3 is expected to be in even higher demand.
In terms of the application environment, the chip model EPF8282ALC84-3 requires the use of HDL language, which is a relatively new technology. As such, engineers must be familiar with this language in order to make full use of the chip model EPF8282ALC84-3. As technology continues to evolve, new technologies and programming languages may be required in order to make full use of the chip model EPF8282ALC84-3.
In conclusion, the chip model EPF8282ALC84-3 is a powerful device that is ideal for high-performance digital signal processing, embedded processing, and image processing. It offers a variety of advantages, such as low power consumption, high speed, and the ability to be reprogrammed without the need for external hardware. As technology continues to evolve, the chip model EPF8282ALC84-3 is expected to be in high demand in a variety of industries. Additionally, the application environment requires the use of HDL language, and new technologies and programming languages may be required in the future in order to make full use of the chip model EPF8282ALC84-3.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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