

EPF8820AQC160-3
EPF8820AQC160-3 ECAD Model
EPF8820AQC160-3 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 120 | |
Number of Outputs | 116 | |
Number of Logic Cells | 672 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 120 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 120 I/O | |
Additional Feature | 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | |
Clock Frequency-Max | 385 MHz | |
Output Function | REGISTERED | |
Power Supplies | 3.3/5,5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQFP-G160 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 160 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP160,1.2SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.07 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | QFP, QFP160,1.2SQ | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EPF8820AQC160-3 Datasheet Download
EPF8820AQC160-3 Overview
The chip model EPF8820AQC160-3 is a complex integrated circuit designed by Efinity Technologies. It is a highly efficient and cost-effective solution for a wide range of applications, including advanced communication systems. The original design intention of the chip model EPF8820AQC160-3 was to provide a reliable and cost-effective solution for communication systems.
The EPF8820AQC160-3 is a powerful integrated circuit that is capable of providing an array of features such as high-speed data transfer, low power consumption, and a wide range of connectivity options. It has been designed to provide an optimal solution for advanced communication systems. The chip model is capable of providing a high level of performance with minimal power consumption. It is also highly reliable, providing a long-term solution for communication systems.
The EPF8820AQC160-3 is also capable of being upgraded in the future, allowing for improved performance and features. It is also capable of being used in advanced communication systems, providing a reliable and cost-effective solution for a wide range of applications. The chip model is also capable of being used in the era of fully intelligent systems, allowing for the development of highly intelligent networks and scenarios.
In order to use the EPF8820AQC160-3, specific design requirements must be followed. The chip model must be configured correctly in order to ensure optimal performance. In addition, the chip model must be tested in order to ensure that it is functioning correctly. It is also important to follow the manufacturer's instructions and guidelines in order to ensure proper operation.
The EPF8820AQC160-3 has been used in a variety of applications, including cellular networks and wireless networks. It has been used in a variety of scenarios, including intelligent networks and scenarios. In addition, it has been used in a variety of case studies, providing a reliable and cost-effective solution for a wide range of applications.
When using the EPF8820AQC160-3, it is important to follow all safety precautions. It is important to ensure that the chip model is properly configured and tested in order to ensure optimal performance. In addition, it is important to follow the manufacturer's instructions and guidelines in order to ensure proper operation.
In conclusion, the EPF8820AQC160-3 is a powerful integrated circuit designed by Efinity Technologies. It is a highly efficient and cost-effective solution for a wide range of applications, including advanced communication systems. The chip model is capable of providing a high level of performance with minimal power consumption and is capable of being upgraded in the future. It is also capable of being used in the era of fully intelligent systems, allowing for the development of highly intelligent networks and scenarios. In order to use the EPF8820AQC160-3, specific design requirements must be followed and it is important to follow all safety precautions.