EPF8820AQC208-2
EPF8820AQC208-2 ECAD Model
EPF8820AQC208-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 152 | |
| Number of Outputs | 148 | |
| Number of Logic Cells | 672 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 152 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 152 I/O | |
| Additional Feature | 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | |
| Clock Frequency-Max | 417 MHz | |
| Output Function | REGISTERED | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | PLASTIC, QFP-208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF8820AQC208-2 Datasheet Download
EPF8820AQC208-2 Overview
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Finally, in terms of actual case studies and precautions, the EPF8820AQC208-2 chip model is designed to provide a high level of performance and reliability in a wide range of applications. It is capable of supporting advanced communication systems, making it suitable for a variety of applications. The chip model also includes a wide range of features and functions, making it suitable for a variety of applications. This includes support for high-speed communication systems, as well as support for a range of data types. When using the EPF8820AQC208-2 chip model, it is important to take into account the specific requirements of the application environment and the potential risks associated with the use of the chip model. It is also important to ensure that the chip model is used in accordance with the manufacturer’s instructions.
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