EPF8820AQC208-2
EPF8820AQC208-2
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rohs
Intel

EPF8820AQC208-2


EPF8820AQC208-2
F18-EPF8820AQC208-2
Active
IC FPGA 152 I/O 208QFP
208-PQFP (28x28)

EPF8820AQC208-2 ECAD Model


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EPF8820AQC208-2 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 5 V
Number of Inputs 152
Number of Outputs 148
Number of Logic Cells 672
Number of Dedicated Inputs 4
Number of I/O Lines 152
Programmable Logic Type LOADABLE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 152 I/O
Additional Feature 672 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max 417 MHz
Output Function REGISTERED
Power Supplies 3.3/5,5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-PQFP-G208
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 20
Number of Terminals 208
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Equivalence Code QFP208,1.2SQ,20
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer ALTERA CORP
Part Package Code QFP
Package Description PLASTIC, QFP-208
Pin Count 208
Reach Compliance Code unknown
HTS Code 8542.39.00.01

EPF8820AQC208-2 Datasheet Download


EPF8820AQC208-2 Overview



The chip model EPF8820AQC208-2 is a highly advanced integrated circuit that is designed for use in a wide variety of applications. Its design is based on the latest technologies and provides excellent performance for a wide range of applications. This chip model is capable of supporting high-speed communication systems, making it ideal for applications such as wireless networks, industrial automation, and smart home systems.


The EPF8820AQC208-2 chip model is designed to provide a high level of performance and reliability in a wide range of applications. It is capable of supporting advanced communication systems, allowing it to be used in a variety of applications. The chip model also includes a wide range of features and functions, making it suitable for a variety of applications. This includes support for high-speed communication systems, as well as support for a range of data types.


The EPF8820AQC208-2 chip model is designed to be highly reliable and efficient. It is designed to be able to provide a high level of performance in a wide range of applications. This includes support for a range of data types, as well as support for advanced communication systems. The chip model also includes a wide range of features and functions, making it suitable for a variety of applications.


In terms of industry trends, the EPF8820AQC208-2 chip model is designed to provide a high level of performance and reliability in a wide range of applications. It is capable of supporting advanced communication systems, making it suitable for a variety of applications. The chip model also includes a wide range of features and functions, making it suitable for a variety of applications. This includes support for high-speed communication systems, as well as support for a range of data types.


As for the future development of related industries, the EPF8820AQC208-2 chip model is designed to provide a high level of performance and reliability in a wide range of applications. It is capable of supporting advanced communication systems, making it suitable for a variety of applications. The chip model also includes a wide range of features and functions, making it suitable for a variety of applications. This includes support for high-speed communication systems, as well as support for a range of data types.


In terms of whether the application environment requires the support of new technologies, it depends on what specific technologies are needed. The EPF8820AQC208-2 chip model is designed to provide a high level of performance and reliability in a wide range of applications. It is capable of supporting advanced communication systems, making it suitable for a variety of applications. The chip model also includes a wide range of features and functions, making it suitable for a variety of applications. This includes support for high-speed communication systems, as well as support for a range of data types.


In terms of the original design intention of the EPF8820AQC208-2 chip model, it is designed to provide a high level of performance and reliability in a wide range of applications. It is capable of supporting advanced communication systems, making it suitable for a variety of applications. The chip model also includes a wide range of features and functions, making it suitable for a variety of applications. This includes support for high-speed communication systems, as well as support for a range of data types.


In terms of the possibility of future upgrades, the EPF8820AQC208-2 chip model is designed to be highly reliable and efficient. It is designed to be able to provide a high level of performance in a wide range of applications. This includes support for a range of data types, as well as support for advanced communication systems. The chip model also includes a wide range of features and functions, making it suitable for a variety of applications.


Finally, in terms of actual case studies and precautions, the EPF8820AQC208-2 chip model is designed to provide a high level of performance and reliability in a wide range of applications. It is capable of supporting advanced communication systems, making it suitable for a variety of applications. The chip model also includes a wide range of features and functions, making it suitable for a variety of applications. This includes support for high-speed communication systems, as well as support for a range of data types. When using the EPF8820AQC208-2 chip model, it is important to take into account the specific requirements of the application environment and the potential risks associated with the use of the chip model. It is also important to ensure that the chip model is used in accordance with the manufacturer’s instructions.



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