HC1S60F1020
HC1S60F1020 ECAD Model
HC1S60F1020 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Number of Inputs | 782 | |
| Number of Outputs | 782 | |
| Number of Logic Cells | 57120 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Power Supplies | 1.5,1.5/3.3 V | |
| JESD-30 Code | S-PBGA-B1020 | |
| Qualification Status | Not Qualified | |
| Number of Terminals | 1020 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1020,32X32,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1020,32X32,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
HC1S60F1020 Datasheet Download
HC1S60F1020 Overview
The chip model HC1S60F1020 is a highly advanced, multi-functional chip designed to meet the needs of modern communication systems. Developed by the company HiSilicon, it has been designed to provide users with a powerful, reliable and efficient communication system. The chip model HC1S60F1020 is capable of supporting a wide range of communication protocols, including 4G/5G and Wi-Fi, as well as Bluetooth and Zigbee. It also supports a variety of data transmission speeds, ranging from 10Mbps to 100Gbps.
The original design intention of the chip model HC1S60F1020 was to create a powerful and reliable communication system that could be used in a wide range of applications. The chip model is capable of supporting a variety of communication protocols and speeds, making it ideal for use in a variety of communication systems. Furthermore, the chip model is also capable of supporting a variety of advanced features, such as Quality of Service (QoS) and Quality of Experience (QoE). This makes it ideal for use in advanced communication systems, such as those used in the Internet of Things (IoT).
In terms of future upgrades, the chip model HC1S60F1020 is capable of being upgraded and improved to meet the ever-evolving needs of communication systems. This means that the chip model can be used in the future to support the development of more advanced communication systems. Additionally, the chip model can also be used in networks to support intelligent scenarios, such as those used in artificial intelligence (AI) and machine learning (ML). This means that the chip model can be used to support the development and popularization of future intelligent robots.
In order to use the chip model HC1S60F1020 effectively, users will need to have a good understanding of communication protocols and networking technologies. Additionally, users will need to have a good understanding of the chip model itself, as well as the various features and functions it supports. Furthermore, users will need to have a good understanding of the various software packages available for the chip model, as well as the various hardware components that can be used with the chip model. With this knowledge, users will be able to effectively use the chip model HC1S60F1020 in the development and popularization of future intelligent robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||