HC20K400FC672
HC20K400FC672
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rohs
Intel

HC20K400FC672


HC20K400FC672
F18-HC20K400FC672
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA672,26X26,40
BGA, BGA672,26X26,40

HC20K400FC672 ECAD Model


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HC20K400FC672 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Number of Inputs 480
Number of Outputs 480
Number of Logic Cells 16640
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Power Supplies 1.8,1.8/3.3 V
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA672,26X26,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

HC20K400FC672 Datasheet Download


HC20K400FC672 Overview



The HC20K400FC672 chip model is a powerful and versatile integrated circuit that offers a wide range of features and benefits. It is designed to meet the needs of a variety of industries and applications, including communications, automotive, medical, and industrial. This chip model is designed to provide superior performance, reliability, and scalability.


The HC20K400FC672 chip model is based on a 32-bit RISC architecture and is capable of delivering high-speed data processing and communication. It is designed to be highly efficient and power-efficient, with a low power consumption profile. This chip model is also designed to be highly reliable and secure, with built-in error correction and security features.


The HC20K400FC672 chip model offers a wide range of features and benefits, including high-speed data processing, low power consumption, and high reliability. It also provides superior scalability and flexibility, allowing it to be used in a variety of applications. This chip model is also designed to be highly compatible with other chips and components, allowing it to be used in advanced communication systems.


The HC20K400FC672 chip model is expected to be in high demand in the coming years, as it is suitable for a wide range of applications. Its superior performance and scalability make it ideal for use in a variety of industries, including automotive, medical, and industrial. Additionally, its low power consumption and high reliability make it a great choice for use in advanced communication systems.


The product description of the HC20K400FC672 chip model includes its 32-bit RISC architecture, high-speed data processing performance, low power consumption, and high reliability. It also provides superior scalability and flexibility, allowing it to be used in a variety of applications. Additionally, its compatibility with other chips and components makes it ideal for use in advanced communication systems.


Actual case studies have found that the HC20K400FC672 chip model is highly reliable and secure, with built-in error correction and security features. Additionally, its low power consumption and high reliability make it a great choice for use in advanced communication systems.


When using the HC20K400FC672 chip model, it is important to take into account its design requirements and specifications. Additionally, it is important to consider the possibility of future upgrades and whether the chip model can be used in advanced communication systems. It is also important to consider the chip model's compatibility with other chips and components, as well as its scalability and flexibility.


In conclusion, the HC20K400FC672 chip model is a powerful and versatile integrated circuit that offers a wide range of features and benefits. It is designed to meet the needs of a variety of industries and applications, including communications, automotive, medical, and industrial. This chip model is designed to provide superior performance, reliability, and scalability. It is expected to be in high demand in the coming years, as it is suitable for a wide range of applications. Additionally, its low power consumption and high reliability make it a great choice for use in advanced communication systems. It is important to take into account its design requirements and specifications, as well as the possibility of future upgrades and compatibility with other chips and components.



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