LC5256MB-5F256I
LC5256MB-5F256I
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Lattice

LC5256MB-5F256I


LC5256MB-5F256I
F11-LC5256MB-5F256I
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IC CPLD 256MC 5NS 256FBGA
256-FPBGA (17x17)

LC5256MB-5F256I ECAD Model


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LC5256MB-5F256I Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ispXPLD® 5000MB
Package Tray
Programmable Type In System Programmable
Delay Time tpd(1) Max 5 ns
Voltage Supply - Internal 2.3V ~ 2.7V
Number of Logic Elements/Blocks 8
Number of Macrocells 256
Number of I/O 141
Operating Temperature -40°C ~ 105°C (TJ)
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LC5256

LC5256MB-5F256I Datasheet Download


LC5256MB-5F256I Overview



The LC5256MB-5F256I is a high-performance, low-power FPGA chip designed by Lattice Semiconductor. It is a member of the MachXO2 family and is the first FPGA to be offered in a BGA package. The device is based on the LatticeECP2M architecture and features 5,256 logic cells, 256 Kbits of embedded memory, and a wide range of I/O options. It is ideal for applications requiring a combination of high performance, low power consumption, and small form factor.


The LC5256MB-5F256I has a total of 5,256 logic cells, 256 Kbits of embedded memory, and up to 456 I/O pins. It is capable of up to 500 MHz operation and features low power consumption of just 1.2 W. The device also includes a range of advanced features such as low-skew clock networks, dedicated high-speed I/O, and an integrated PCIe Gen2 x4 interface.


The LC5256MB-5F256I is suitable for a wide range of applications, including industrial automation, medical imaging, and consumer electronics. It is also well suited for use in high-speed networking, communications, and video applications. The device is available in a BGA package, which makes it easy to integrate into existing designs and provides a high level of flexibility.


In summary, the LC5256MB-5F256I is a high-performance, low-power FPGA chip designed by Lattice Semiconductor. It features 5,256 logic cells, 256 Kbits of embedded memory, and up to 456 I/O pins. It is suitable for a wide range of applications, including industrial automation, medical imaging, and consumer electronics. The device is available in a BGA package, which makes it easy to integrate into existing designs and provides a high level of flexibility.



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