LFECP6E-3FN256C
LFECP6E-3FN256C
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Lattice

LFECP6E-3FN256C


LFECP6E-3FN256C
ECP
F11-LFECP6E-3FN256C
Active
IC FPGA 195 I/O 256FBGA
256-FPBGA (17x17)

LFECP6E-3FN256C ECAD Model


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LFECP6E-3FN256C Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ECP
Package Tray
Number of Logic Elements/Cells 6100
Total RAM Bits 94208
Number of I/O 195
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number LFECP6

LFECP6E-3FN256C Datasheet Download


LFECP6E-3FN256C Overview



The LFECP6E-3FN256C is a Field Programmable Gate Array (FPGA) chip manufactured by Lattice Semiconductor. It is a low power, low cost FPGA with a low pin count and high performance. This chip is based on the LatticeECP3 family of FPGAs and is designed to provide an efficient and cost-effective solution for a wide range of applications.


The LFECP6E-3FN256C is a low-cost, low-power FPGA with a 256-pin package size. It has a total of 9,792 logic elements, 512 Kbits of embedded memory, and a maximum clock frequency of 250 MHz. It also has a wide range of I/O options, including LVDS, LVCMOS, and differential I/O. In addition, the chip has built-in support for several popular protocols, such as PCI Express, Ethernet, USB, and Serial RapidIO.


The LFECP6E-3FN256C is suitable for a wide range of applications, including embedded control, industrial automation, medical imaging, security, and communications. It is ideal for applications that require low power consumption and high performance, such as video processing, motor control, and data acquisition. This chip is also suitable for applications that require low cost and high flexibility, such as prototyping and system-on-chip (SoC) designs.


Overall, the LFECP6E-3FN256C is a low-cost, low-power, high-performance FPGA chip with a wide range of I/O options and built-in support for popular protocols. It is suitable for a wide range of applications, including embedded control, industrial automation, medical imaging, security, and communications.



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