OR3T306BA256I-DB
OR3T306BA256I-DB
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OR3T306BA256I-DB


OR3T306BA256I-DB
F11-OR3T306BA256I-DB
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IC FPGA 221 I/O 256BGA
256-FPBGA (17x17)

OR3T306BA256I-DB ECAD Model


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OR3T306BA256I-DB Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ORCA® 3
Package Tray
Number of Logic Elements/Cells 1568
Total RAM Bits 25600
Number of I/O 221
Number of Gates 48000
Voltage - Supply 3V ~ 3.6V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number OR3T30

OR3T306BA256I-DB Datasheet Download


OR3T306BA256I-DB Overview



The OR3T306BA256I-DB chip model is a high-performance, low-power, cost-effective, and reliable Field Programmable Gate Array (FPGA) device. It is designed and manufactured by ORCA Microsystems, Inc. It is based on a Virtex-6 FPGA architecture and is capable of providing up to 256K logic cells. It is equipped with several advanced features such as high-speed transceiver blocks, embedded block RAM, and dedicated multipliers.


The OR3T306BA256I-DB chip model is suitable for a wide range of applications such as high-speed communication, data processing, and signal processing. It has a maximum operating frequency of 400 MHz and a maximum operating temperature of 105 degrees Celsius. It also supports a wide range of I/O standards such as LVDS, LVPECL, and SSTL. It is also equipped with a built-in power-on reset circuit and an on-chip JTAG controller.


The OR3T306BA256I-DB chip model is ideal for applications such as industrial automation, medical imaging, motor control, and aerospace. It is also suitable for the development of high-speed and low-power systems. It is available in a variety of packages such as BGA, FBGA, and VQFP. The device is also RoHS compliant and is fully compatible with the industry-standard tools and development suites.



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