OR3T556BA256-DB
OR3T556BA256-DB
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OR3T556BA256-DB


OR3T556BA256-DB
F11-OR3T556BA256-DB
Active
IC FPGA 223 I/O 256BGA
256-FPBGA (17x17)

OR3T556BA256-DB ECAD Model


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OR3T556BA256-DB Attributes


Type Description Select
Mfr Lattice Semiconductor Corporation
Series ORCA® 3
Package Tray
Number of Logic Elements/Cells 2592
Total RAM Bits 43008
Number of I/O 223
Number of Gates 80000
Voltage - Supply 3V ~ 3.6V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 70°C (TA)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number OR3T556

OR3T556BA256-DB Datasheet Download


OR3T556BA256-DB Overview



The OR3T556BA256-DB is a 256-bit one-time-programmable (OTP) non-volatile memory chip. It is a low-power, low-voltage, high-density device with a wide operating temperature range of -40°C to +85°C. The chip is housed in a small, 32-pin thin-shrink small-outline package (TSSOP) and is suitable for all kinds of applications.


The OR3T556BA256-DB offers a wide range of features and specifications. It has an access time of less than 10ns and a data retention of 20 years. The device has a write time of less than 10ms and a write cycle of up to 1 million times. The chip has an endurance of up to 10 million cycles and a data security of up to 256 bits. The chip also supports a wide range of programming and verification voltages.


The OR3T556BA256-DB is suitable for a variety of applications, including automotive, industrial, medical, and consumer electronics. It can be used in applications such as embedded systems, embedded controllers, and data storage. The chip is also suitable for applications such as factory automation, RFID tags, and smart cards.


Overall, the OR3T556BA256-DB is a high-performance, low-power, low-voltage, one-time-programmable non-volatile memory chip with a wide operating temperature range and a wide range of features and specifications. It is suitable for a variety of applications, including automotive, industrial, medical, and consumer electronics.



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