AGLN060V2-ZVQ100I
AGLN060V2-ZVQ100I
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Microchip

AGLN060V2-ZVQ100I


AGLN060V2-ZVQ100I
F8-AGLN060V2-ZVQ100I
Active
IC FPGA 71 I/O 100VQFP
100-VQFP (14x14)

AGLN060V2-ZVQ100I ECAD Model


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AGLN060V2-ZVQ100I Attributes


Type Description Select
Mfr Microchip Technology
Series IGLOO nano
Package Tray
Number of Logic Elements/Cells 1536
Total RAM Bits 18432
Number of I/O 71
Number of Gates 60000
Voltage - Supply 1.14V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 100-TQFP
Supplier Device Package 100-VQFP (14x14)
Base Product Number AGLN060

AGLN060V2-ZVQ100I Datasheet Download


AGLN060V2-ZVQ100I Overview



The AGLN060V2-ZVQ100I is a low-power, high-performance integrated circuit (IC) designed for use in a variety of applications. It is a single-chip solution that combines a high-performance processor, memory, and peripherals on a single die. It is based on the ARM Cortex-A57 processor, which is a 64-bit processor core that can be clocked up to 2 GHz. The processor is capable of executing multiple instructions in parallel, resulting in improved performance and power efficiency.


The AGLN060V2-ZVQ100I also includes a high-bandwidth, low-latency memory controller, which is capable of supporting up to 8GB of DDR4 RAM. It also includes a range of peripheral interfaces, including USB 3.0, PCIe, SATA, and Ethernet. The chip also supports a range of multimedia features, such as 1080p video decoding, 4K video encoding, and 3D graphics.


The AGLN060V2-ZVQ100I is suitable for a variety of applications, including embedded systems, digital signage, industrial automation, and automotive infotainment. It can also be used in networking and storage applications, and is capable of providing high-performance computing and networking capabilities in a single package. The chip is also designed to be power efficient, with a low power consumption of 1.2W.


Overall, the AGLN060V2-ZVQ100I is a powerful, low-power, high-performance integrated circuit that is suitable for a range of applications. It combines a powerful processor, memory, and peripherals in a single package, and is capable of providing high-performance computing and networking capabilities in a power efficient package.



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