XA3S250E-4PQG208I
XA3S250E-4PQG208I
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Xilinx

XA3S250E-4PQG208I


XA3S250E-4PQG208I
F20-XA3S250E-4PQG208I
Active
IC FPGA 158 I/O 208QFP
208-PQFP (28x28)

XA3S250E-4PQG208I ECAD Model


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XA3S250E-4PQG208I Attributes


Type Description Select
Mfr AMD Xilinx
Series Automotive, AEC-Q100, Spartan®-3E XA
Package Tray
Number of LABs/CLBs 612
Number of Logic Elements/Cells 5508
Total RAM Bits 221184
Number of I/O 158
Number of Gates 250000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 208-BFQFP
Supplier Device Package 208-PQFP (28x28)
Base Product Number XA3S250E

XA3S250E-4PQG208I Datasheet Download


XA3S250E-4PQG208I Overview



The XA3S250E-4PQG208I is a high-performance, low-power, and low-cost FPGA (Field Programmable Gate Array) chip from Xilinx. It is designed for use in a wide range of applications including embedded systems, industrial automation, and communications.


The XA3S250E-4PQG208I is a single-chip FPGA with a maximum capacity of 250K logic cells and up to 4,096Kbits of block RAM. It features up to 280 I/O pins, with up to 12 differential pairs, and up to 8 LVDS pairs. It has a maximum clock frequency of 200 MHz, and a maximum operating temperature of 85°C.


The XA3S250E-4PQG208I is based on the Xilinx Spartan-3E architecture, and includes features such as distributed RAM, distributed multipliers, and DSP blocks. It also supports multiple clock domains, and has a wide variety of I/O standards, including LVDS, LVCMOS, and HSTL.


The XA3S250E-4PQG208I is ideal for applications requiring low power consumption and high performance, such as industrial automation, automotive systems, medical devices, and consumer electronics. It is also suitable for applications requiring high-speed data transfer and processing, such as communications, networking, and video processing. Additionally, its low cost makes it an attractive option for cost-sensitive applications.



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