XA7Z030-1FBG484I
XA7Z030-1FBG484I
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rohs
Xilinx

XA7Z030-1FBG484I


XA7Z030-1FBG484I
F20-XA7Z030-1FBG484I
Active
CMOS, FBGA-484
FBGA-484

XA7Z030-1FBG484I ECAD Model


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XA7Z030-1FBG484I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Surface Mount YES
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Power Supplies 1,1.8 V
UV Erasable N
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 250
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 484
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 2.54 mm
Width 23 mm
Length 23 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-484
Reach Compliance Code not_compliant
HTS Code 8542.31.00.01

XA7Z030-1FBG484I Datasheet Download


XA7Z030-1FBG484I Overview



The XA7Z030-1FBG484I chip model is a revolutionary new product that has been developed by the leading chip manufacturer, Xilinx. It is a highly advanced and powerful processor that is designed to meet the needs of the most demanding applications. The chip model is based on the latest Xilinx Zynq-7000 All Programmable System-on-Chip (AP SoC) architecture, and it is the first to offer a combination of the ARM dual-core Cortex-A9 processor and the Xilinx 7-series FPGA fabric.


The XA7Z030-1FBG484I chip model is a powerful and versatile processor that offers a wide range of advantages for a variety of applications. It provides a high level of performance, with up to 1.5 GHz of processing power and up to 1 GB of on-chip memory. It also offers a wide range of communication interfaces, including Ethernet, USB, and PCI Express. It is also capable of supporting multiple operating systems, such as Linux, Windows, and VxWorks.


Due to the high performance and versatility of the XA7Z030-1FBG484I chip model, it is expected to be in high demand in various industries in the future. It is well-suited for use in data centers, telecommunications, and other applications that require high performance and low power consumption. It is also expected to be used in embedded systems, medical devices, and other applications that require a reliable and high-performance processor.


The original design intention of the XA7Z030-1FBG484I chip model was to provide a powerful and versatile processor that could meet the needs of the most demanding applications. It is designed to be easily upgradable and customizable, allowing users to tailor the processor to their specific needs. It is also designed to be highly reliable and efficient, with a low power consumption rate and a long lifetime.


As technology advances, the XA7Z030-1FBG484I chip model will be able to take advantage of new technologies and features. It is possible that future upgrades may include support for new communication protocols, improved memory and storage capabilities, and even the ability to support artificial intelligence. This could open up a whole new range of possibilities for the chip model, and it is likely that it will continue to be in high demand in the future.


The XA7Z030-1FBG484I chip model is also capable of being applied to the development and popularization of future intelligent robots. It is powerful enough to handle the complex calculations and algorithms necessary for the operation of robots, and its reliability and low power consumption make it ideal for use in robotics applications. In order to use the chip model effectively, it is important to have a good understanding of the Xilinx Zynq-7000 All Programmable System-on-Chip (AP SoC) architecture, as well as knowledge of C programming language and embedded systems.



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