XC2V4000-5BFG957C
XC2V4000-5BFG957C ECAD Model
XC2V4000-5BFG957C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 684 | |
| Number of Outputs | 684 | |
| Number of Logic Cells | 51840 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 5760 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 5760 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B957 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 957 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA957,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | |
| Pin Count | 957 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V4000-5BFG957C Datasheet Download
XC2V4000-5BFG957C Overview
The XC2V4000-5BFG957C chip model is an advanced Field Programmable Gate Array (FPGA) designed by Xilinx. It is a versatile chip that is capable of handling a variety of tasks, including high-speed networking, digital signal processing, and embedded systems. Its original design intention was to provide a cost-effective solution for the development of complex applications.
The XC2V4000-5BFG957C is suitable for a wide range of applications, including advanced communication systems. It is capable of delivering high-speed Ethernet and other communication protocols, as well as supporting multiple clock frequencies and data rates. This makes it an ideal solution for modern communication systems that require high-speed data transmission. In addition, the chip model can also be used in intelligent scenarios, such as machine learning and artificial intelligence, due to its large capacity and high-speed performance.
The XC2V4000-5BFG957C chip model is highly configurable and can be tailored to meet specific design requirements. It has a wide range of features, including an on-chip memory controller, a multi-channel DMA controller, and a high-speed serial transceiver. It also supports a variety of protocols, including Ethernet, USB, and PCIe. The chip model is capable of handling a wide range of data types, including audio, video, and image processing.
In addition, the XC2V4000-5BFG957C chip model is also suitable for future upgrades. It is capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0. This makes it an ideal solution for advanced communication systems that require high-speed data transmission and low latency.
Case studies have been conducted to demonstrate the performance of the XC2V4000-5BFG957C chip model. The results have shown that the chip model is capable of delivering high-speed data transmission and low latency, making it an ideal solution for advanced communication systems. However, it is important to note that the chip model is not suitable for applications that require high levels of security, such as military communication systems.
In conclusion, the XC2V4000-5BFG957C chip model is a versatile and cost-effective solution for the development of complex applications. It is capable of handling a variety of tasks, including high-speed networking, digital signal processing, and embedded systems. It is also suitable for future upgrades, making it an ideal solution for advanced communication systems that require high-speed data transmission and low latency. However, it is important to note that the chip model is not suitable for applications that require high levels of security.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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