XC2V6000-4BF957I
XC2V6000-4BF957I
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Xilinx

XC2V6000-4BF957I


XC2V6000-4BF957I
F20-XC2V6000-4BF957I
Active
IC FPGA 684 I/O 957FCBGA
957-FCBGA (40x40)

XC2V6000-4BF957I ECAD Model


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XC2V6000-4BF957I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 8448
Total RAM Bits 2654208
Number of I/O 684
Number of Gates 6000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 957-BBGA, FCBGA
Supplier Device Package 957-FCBGA (40x40)
Base Product Number XC2V6000

XC2V6000-4BF957I Datasheet Download


XC2V6000-4BF957I Overview



The XC2V6000-4BF957I chip is a high-performance field-programmable gate array (FPGA) from Xilinx. It is a mid-range device with a capacity of up to 60,000 system gates and up to 4,096 user I/Os. The chip has a Virtex-II Pro architecture and is built on a 0.15um process. It has a wide variety of features, including high-speed clock management, distributed RAM, and embedded multipliers. The chip is suitable for a variety of applications, such as high-performance data processing, image processing, video processing, and communication systems.


In terms of specifications, the XC2V6000-4BF957I has 4,096 user I/Os and up to 60,000 system gates. It has a maximum operating frequency of 250 MHz with a power dissipation of 1.5 W. The chip also has a 0.15um process and a 4.2V core voltage. It also has an on-chip clock management system that supports up to 16 global clock networks and up to 4,096 user I/Os. Additionally, it has two embedded 18x18 multipliers and up to 2.5Mbits of distributed RAM.


The XC2V6000-4BF957I is suitable for a variety of applications, including high-performance data processing, image processing, video processing, and communication systems. It is also suitable for industrial control, automotive, and medical applications. Additionally, the chip is suitable for applications that require high-speed clock management, distributed RAM, and embedded multipliers.



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