XC2V8000-4FF1152I
XC2V8000-4FF1152I
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rohs
Xilinx

XC2V8000-4FF1152I


XC2V8000-4FF1152I
F20-XC2V8000-4FF1152I
Active
IC FPGA 824 I/O 1152FCBGA
1152-FCBGA (35x35)

XC2V8000-4FF1152I ECAD Model


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XC2V8000-4FF1152I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-II
Package Tray
Number of LABs/CLBs 11648
Total RAM Bits 3096576
Number of I/O 824
Number of Gates 8000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FCBGA (35x35)
Base Product Number XC2V8000

XC2V8000-4FF1152I Datasheet Download


XC2V8000-4FF1152I Overview



The XC2V8000-4FF1152I is a field-programmable gate array (FPGA) chip from Xilinx. It is a high-performance, low-power device that is ideal for a variety of applications.


The chip features an impressive 8,000 logic cells, with up to 152,000 logic elements and 1.15 million system gates. It also has a wide range of I/O options, including up to 1176 user I/O pins, up to 16 global clock networks, and up to 8 differential clock pairs. The chip is also equipped with a high-speed, low-power, low-skew clock distribution network.


The XC2V8000-4FF1152I is designed to handle a variety of applications, including high-speed networking, digital signal processing, and embedded systems. It is well-suited for applications that require high-performance, low-power solutions, such as video and image processing, wireless communications, and data storage.


The chip is also designed to be highly reliable and robust, with built-in error detection and correction features. It has been tested for radiation tolerance and is compliant with the European Union's RoHS directive.


Overall, the XC2V8000-4FF1152I is a powerful, low-power FPGA chip that is suitable for a wide range of applications. Its impressive features and reliable performance make it an ideal choice for high-performance, low-power solutions.



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