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XC2VP100-7FFG1704C
XC2VP100-7FFG1704C ECAD Model
XC2VP100-7FFG1704C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of CLBs | 11024 | |
Combinatorial Delay of a CLB-Max | 280 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 11024 CLBS | |
Clock Frequency-Max | 1.35 GHz | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1704 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1704 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.45 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 1704 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2VP100-7FFG1704C Datasheet Download
XC2VP100-7FFG1704C Overview
The chip model XC2VP100-7FFG1704C is a new type of chip model released in the chip industry. It is a fully programmable device that can be used in a variety of applications, such as embedded systems, digital signal processing, and image processing. With its rich features and advanced technology, this chip model is becoming increasingly popular in the chip industry.
The XC2VP100-7FFG1704C chip model has a number of advantages. It has a high integration level, which allows for more features in a smaller package. Its low power consumption makes it suitable for a wide range of applications. Additionally, it has a high clock speed, which makes it suitable for high-speed applications. Furthermore, its programmable logic blocks enable users to customize their designs to meet their specific needs.
As the chip industry continues to develop, the demand for the XC2VP100-7FFG1704C chip model is expected to continue to grow. This is due to its high performance and flexibility, which make it suitable for a wide range of applications. In addition, its low power consumption makes it a great choice for embedded systems and other applications that require low power consumption.
The XC2VP100-7FFG1704C chip model can also be used in the development and popularization of future intelligent robots. This is because it has the ability to handle complex tasks and can be programmed to perform specific tasks. Furthermore, it is capable of responding to changes in its environment and can be used to control a variety of robotic systems. In order to use the chip model effectively, technical talents such as engineers and programmers are required to program the chip model to perform specific tasks.
In conclusion, the XC2VP100-7FFG1704C chip model is a powerful and versatile device that is becoming increasingly popular in the chip industry. Its high performance and low power consumption make it suitable for a wide range of applications. Furthermore, it can be used in the development and popularization of future intelligent robots. In order to use the chip model effectively, technical talents such as engineers and programmers are required. As the chip industry continues to develop, the demand for the XC2VP100-7FFG1704C chip model is expected to continue to grow.
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