XC3S4000L-4FG900C
XC3S4000L-4FG900C
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rohs
Xilinx

XC3S4000L-4FG900C


XC3S4000L-4FG900C
F20-XC3S4000L-4FG900C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-900
FBGA-900

XC3S4000L-4FG900C ECAD Model


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XC3S4000L-4FG900C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.2 V
Number of Inputs 633
Number of Outputs 633
Number of Logic Cells 62208
Number of Equivalent Gates 4000000
Number of CLBs 6912
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 6912 CLBS, 4000000 GATES
Power Supplies 1.2,1.2/3.3,2.5 V
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-900
Pin Count 900
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC3S4000L-4FG900C Datasheet Download


XC3S4000L-4FG900C Overview



The chip model XC3S4000L-4FG900C is a Field-Programmable Gate Array (FPGA) manufactured by Xilinx, Inc. It is designed for applications that require high levels of performance, reliability, and scalability. This chip model is particularly suitable for applications that require high-speed data processing and communication, such as video processing, image processing, and machine learning.


The XC3S4000L-4FG900C has several advantages over other FPGA models. It features a low-power, high-performance architecture that is ideal for embedded applications. It also offers a wide range of I/O capabilities, including a high-speed serial port, a low-speed serial port, and a variety of other peripheral interfaces. Additionally, this model offers a comprehensive set of development tools, including the Xilinx Vivado Design Suite and the Xilinx Software Development Kit.


The XC3S4000L-4FG900C is expected to be in high demand in the future, as more applications are developed that require the high performance and reliability of this chip model. This is due to the fact that the XC3S4000L-4FG900C is an ideal solution for applications that require high-speed data processing and communication. Additionally, the low-power, high-performance architecture of this chip model makes it a cost-effective solution for embedded applications.


In terms of product description and design requirements, the XC3S4000L-4FG900C is based on the Spartan-6 FPGA architecture and features a 900K logic cells capacity. It is optimized for high-speed data processing, with a maximum clock frequency of 350MHz and a maximum I/O bandwidth of 1.25Gbps. It also offers a wide range of I/O capabilities, including a high-speed serial port, a low-speed serial port, and a variety of other peripheral interfaces.


In terms of actual case studies, the XC3S4000L-4FG900C has been used in a variety of applications, including video processing, image processing, and machine learning. In particular, the chip model has been used in the development of a high-speed video processor, which is capable of processing up to 1080p video at 60 frames per second. Additionally, the chip model has been used in the development of a machine learning system, which is capable of recognizing objects in real-time.


Finally, when considering the application environment of the XC3S4000L-4FG900C, it is important to consider the specific technologies that are required. For example, if the application requires high-speed data processing, then the chip model must be capable of supporting high clock frequencies. Additionally, if the application requires a wide range of I/O capabilities, then the chip model must be capable of supporting a variety of peripheral interfaces.


In conclusion, the chip model XC3S4000L-4FG900C is an ideal solution for applications that require high-speed data processing and communication. It offers a low-power, high-performance architecture, a wide range of I/O capabilities, and a comprehensive set of development tools. Additionally, it has been used in a variety of applications, including video processing, image processing, and machine learning. When considering the application environment of the XC3S4000L-4FG900C, it is important to consider the specific technologies that are required.



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