XC4062XL-3HQG240C
XC4062XL-3HQG240C ECAD Model
XC4062XL-3HQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 40000 | |
| Number of CLBs | 2304 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2304 CLBS, 40000 GATES | |
| Additional Feature | MAX USABLE 62000 LOGIC GATES | |
| Clock Frequency-Max | 166 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | HFQFP, | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC4062XL-3HQG240C Datasheet Download
XC4062XL-3HQG240C Overview
The XC4062XL-3HQG240C chip model is a high-performance, low-power FPGA solution designed for digital signal processing, embedded processing, and image processing applications. It is capable of handling complex tasks with ease and can be used with HDL language for further customization. The chip model is designed to meet the needs of today’s demanding applications and can be used in advanced communication systems.
The XC4062XL-3HQG240C chip model features a high-performance architecture, providing a wide range of features and capabilities. It is designed to support a variety of data processing tasks, including high-performance digital signal processing, embedded processing, image processing, and other applications. The chip model also supports the use of HDL language for further customization, allowing users to create their own custom designs.
The XC4062XL-3HQG240C chip model is designed to be highly scalable, allowing for future upgrades and enhancements. It is designed to be compatible with a wide range of communication systems, including advanced communication systems such as 5G and beyond. It also supports a variety of data rates and protocols, allowing for a wide range of applications.
When designing with the XC4062XL-3HQG240C chip model, it is important to consider the product description and specific design requirements. This includes selecting the right components, understanding the data processing requirements, and selecting the right HDL language. Additionally, it is important to consider the actual case studies and precautions when using the chip model. This includes understanding the power requirements, the signal integrity requirements, and the system-level requirements.
Overall, the XC4062XL-3HQG240C chip model is a powerful and versatile solution for digital signal processing, embedded processing, and image processing applications. It is designed to be highly scalable and can be used with HDL language for further customization. Additionally, it is designed to be compatible with advanced communication systems, allowing for a wide range of applications. When designing with the chip model, it is important to consider the product description and specific design requirements, as well as actual case studies and precautions.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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