XC4085XLA-08BG352I
XC4085XLA-08BG352I ECAD Model
XC4085XLA-08BG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 289 | |
| Number of Outputs | 289 | |
| Number of Logic Cells | 7448 | |
| Number of Equivalent Gates | 55000 | |
| Number of CLBs | 3136 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3136 CLBS, 55000 GATES | |
| Additional Feature | CAN ALSO USE 180000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4085XLA-08BG352I Datasheet Download
XC4085XLA-08BG352I Overview
The chip model XC4085XLA-08BG352I is a high-performance processor chip designed by Intel. It is based on Intel's 14nm process technology, and is suitable for applications such as the Internet of Things, artificial intelligence, and autonomous driving. This chip has a wide range of features that make it suitable for a variety of applications, including a powerful computing performance, low power consumption, and high scalability.
In terms of industry trends, the XC4085XLA-08BG352I chip is expected to be widely used in the future, as it can provide high-performance computing power for various applications. It is also expected to be used in the development of intelligent robots, as the chip provides a powerful computing platform for the development of advanced algorithms.
In terms of application environment, the XC4085XLA-08BG352I chip is expected to be used in a variety of scenarios, such as the Internet of Things, artificial intelligence, autonomous driving, and intelligent robots. To use the chip effectively, it is important to have a good understanding of the specific design requirements and the product description. It is also important to have a good understanding of the actual case studies and precautions related to the chip.
In terms of technical talents, the XC4085XLA-08BG352I chip requires a certain level of expertise in order to be used effectively. It is important to have a good understanding of the chip's features and capabilities, as well as the relevant technologies required to use the chip in various application scenarios. The chip also requires a certain level of knowledge in programming, as well as a good understanding of the underlying hardware and software architectures.
Overall, the XC4085XLA-08BG352I chip is a powerful processor chip that can be used in a variety of applications. It is expected to be widely used in the future, and its application environment requires the support of new technologies. To use the chip effectively, it is important to have a good understanding of the product description, the design requirements, the actual case studies, and the necessary technical talents.
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