XC4085XLA-08BG560C
XC4085XLA-08BG560C ECAD Model
XC4085XLA-08BG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 3136 | |
| Number of Equivalent Gates | 55000 | |
| Number of CLBs | 3136 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3136 CLBS, 55000 GATES | |
| Additional Feature | CAN ALSO USE 180000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC4085XLA-08BG560C Datasheet Download
XC4085XLA-08BG560C Overview
The XC4085XLA-08BG560C chip model is a versatile, high-performance integrated circuit (IC) for a wide range of applications. It is a low-power, low-cost, and high-speed solution for embedded systems, making it an ideal choice for a variety of industries. The chip features a wide range of features, including a low-power consumption, high-speed performance, and a wide range of peripherals and interfaces.
The XC4085XLA-08BG560C chip model is expected to be in high demand in a variety of industries in the future. It is a cost-effective solution for embedded systems, making it ideal for a range of applications, including consumer electronics, automotive, industrial, and medical. As the demand for intelligent systems continues to grow, the XC4085XLA-08BG560C chip model is expected to be increasingly adopted in a variety of industries.
The XC4085XLA-08BG560C chip model is designed to be used in networks and intelligent scenarios. It can be used in a variety of applications, including industrial automation, intelligent transportation, smart home, and smart city. It is also suitable for use in the era of fully intelligent systems, as it is capable of providing high-performance and low-power solutions for these applications.
The XC4085XLA-08BG560C chip model is designed to meet a variety of specific design requirements. It includes a wide range of peripherals and interfaces, such as Ethernet, USB, UART, and I2C, which make it suitable for a range of applications. It also features a low-power consumption, high-speed performance, and a wide range of features.
Case studies have shown that the XC4085XLA-08BG560C chip model is a reliable and cost-effective solution for a variety of applications. It has been used in a range of industries, including consumer electronics, automotive, industrial, and medical. It has also been used in a variety of intelligent scenarios, such as industrial automation, intelligent transportation, smart home, and smart city.
When using the XC4085XLA-08BG560C chip model, it is important to take certain precautions. It is important to ensure that the chip is compatible with the application and the environment in which it is being used. It is also important to ensure that the chip is properly configured and that any necessary updates are applied. Finally, it is important to ensure that the chip is properly maintained and that any necessary repairs are carried out.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||