XC4085XLA-08HQ208I
XC4085XLA-08HQ208I ECAD Model
XC4085XLA-08HQ208I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 160 | |
| Number of Outputs | 160 | |
| Number of Logic Cells | 7448 | |
| Number of Equivalent Gates | 55000 | |
| Number of CLBs | 3136 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3136 CLBS, 55000 GATES | |
| Additional Feature | CAN ALSO USE 180000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Equivalence Code | HQFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Package Description | QFP-208 | |
| Pin Count | 208 |
XC4085XLA-08HQ208I Datasheet Download
XC4085XLA-08HQ208I Overview
The XC4085XLA-08HQ208I chip model is a cutting-edge technology that has revolutionized the chip industry. It is an integrated circuit (IC) with a wide range of applications, from network to intelligent scenarios. It has a range of features that make it ideal for use in the era of fully intelligent systems.
The XC4085XLA-08HQ208I chip model is designed to meet the highest standards of quality and reliability. It is designed to be highly efficient and cost-effective, with low power consumption and high performance. It is also designed to be highly flexible and customizable, with a range of options that can be configured to meet the needs of any application.
The chip model XC4085XLA-08HQ208I is a highly advanced technology that is capable of supporting a wide range of new technologies. It is capable of supporting a range of wireless technologies, such as Wi-Fi, Bluetooth, and LTE. It is also capable of supporting a range of advanced sensing technologies, such as infrared and ultrasonic sensors.
In terms of future applications, the XC4085XLA-08HQ208I chip model is capable of supporting a wide range of intelligent scenarios. It is capable of supporting a range of artificial intelligence (AI) algorithms, such as deep learning, natural language processing, and computer vision. It is also capable of supporting a range of Internet of Things (IoT) applications, such as remote monitoring and control.
In terms of industry trends, the XC4085XLA-08HQ208I chip model is set to become increasingly popular in the coming years. It is expected to be widely used in a range of applications, from consumer electronics to industrial automation. It is also expected to be used in a range of intelligent scenarios, such as autonomous vehicles and smart homes.
The product description and specific design requirements of the XC4085XLA-08HQ208I chip model are extensive and highly detailed. It has a range of features that make it suitable for a variety of applications, such as high-speed data transmission, low power consumption, and advanced security features. It also has a range of design considerations that need to be taken into account, such as temperature range, operating voltage, and package size.
In terms of actual case studies and precautions, the XC4085XLA-08HQ208I chip model has been successfully used in a range of applications. It has been used in consumer electronics, industrial automation, and a range of intelligent scenarios. It has also been used in a range of IoT applications, such as remote monitoring and control. However, it is important to note that the chip model requires careful consideration of the application environment before it can be used. It is important to ensure that the chip model is compatible with the application environment and that all design requirements are met.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||